Anode for electroplating and method for electroplating using anode

Patent metadata

Field	Value
Publication number	US-9556534-B2
Application number	US-201214344675-A
Country	US
Kind code	B2
Filing date	Aug 13, 2012
Priority date	Sep 13, 2011
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

First claim

The invention claimed is:

1. A method for electroplating which comprises electroplating a desired metal present in an aqueous electrolytic solution onto a cathode with an anode comprising a conductive substrate and a catalytic layer formed on the conductive substrate, and the catalytic layer is composed of amorphous ruthenium oxide and amorphous tantalum oxide and does not contain IrO 2 .

2. The method for electroplating according to claim 1 , wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

3. The method for electroplating according to claim 1 , wherein a mole ratio of ruthenium to tantalum in the catalytic layer is 50:50.

4. The method for electroplating according to claim 3 , wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

5. The method for electroplating according to claim 1 , wherein the anode further comprises an intermediate layer formed between the catalytic layer and the conductive substrate.

6. The method for electroplating according to claim 5 , wherein the intermediate layer contains crystalline iridium oxide and amorphous tantalum oxide.

7. The method for electroplating according to claim 6 , wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

8. The method for electroplating according to claim 5 , wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

9. The method for electroplating according to claim 1 , wherein the catalytic layer consists of amorphous ruthenium oxide and amorphous tantalum oxide.

Assignees

• Morimitsu Masatsugu
• The Doshisha

Inventors

• Morimitsu Masatsugu

Classifications

• C25D17/10 Primary

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D11/02

  Anodisation · CPC title

• C25C7/02

  Electrodes (consumable anodes for the refining the metals C25C1/00 - C25C5/00); Connections thereof · CPC title

• C25B11/097

  comprising two or more noble metals or noble metal alloys · CPC title