Temperature regulator, cooling device, and method for manufacturing temperature regulator

Patent metadata

Field	Value
Publication number	US-9556524-B2
Application number	US-201113696156-A
Country	US
Kind code	B2
Filing date	Apr 19, 2011
Priority date	May 7, 2010
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A temperature regulator or the like that can circulate a desired thermal medium and efficiently transfer the heat of the thermal medium is provided. The temperature regulator includes a pipe that is made of a metal or alloy with corrosion resistance to a predetermined thermal medium and that serves as a flow path for circulating the thermal medium; and a plate in which the pipe is buried, wherein the plate is formed by accelerating powder made of aluminum (Al) or alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe.

First claim

The invention claimed is:

1. A temperature regulator comprising:
a pipe that is made of a metal with corrosion resistance to a predetermined thermal medium, or an alloy with corrosion resistance to the predetermined thermal medium, and serves as a flow path for circulating the thermal medium;
a plate in which the pipe is buried, the plate including:
a deposition portion formed by accelerating powder made of aluminum (Al) or aluminum alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe, and the deposition portion is dug into the pipe at an interface between the deposition portion and the pipe;
a base plate adjacent to the pipe and made of aluminum or aluminum alloy;
a support pole connected to a center of the deposition portion of the plate to support the plate;
an introduction duct housed in the support pole and connected to an inlet port of the pipe; and
a discharge duct housed in the support pole and connected to an outlet port of the pipe,

wherein the pipe is disposed on a smooth flat surface of the base plate, the base plate defines an upper surface, a distance between the upper surface and pipe is uniform, and a thickness of the deposition portion is thicker than a thickness of the base plate.

2. The temperature regulator according to claim 1 , wherein the plate is formed by using a cold spray technique.

3. The temperature regulator according to claim 1 , wherein the plate has a substrate holding surface for placing a substrate to be subjected to temperature regulation.

4. The temperature regulator according to claim 1 , wherein the pipe is made of any of copper (Cu), copper-based alloy, stainless steel, nickel (Ni), nickel-based alloy, tantalum (Ta), tantalum-based alloy, niobium (Nb), niobium-based alloy, titanium, titanium-based alloy, and copper-nickel alloy.

5. A cooling device comprising:
a temperature regulator comprising:
a pipe that is made of a metal or alloy with corrosion resistance to a predetermined thermal medium and serves as a flow path for circulating the thermal medium;
a plate in which the pipe is buried, the plate including a deposition portion and a base plate, the deposition portion formed by accelerating powder made of aluminum (Al) or aluminum alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe, and the deposition portion is dug into the pipe at an interface between the deposition portion and the pipe, wherein the pipe is disposed on a smooth flat surface of the base plate;
a support pole connected to a center of the deposition portion of the plate to support the plate;
an introduction duct housed in the support pole and connected to an inlet port of the pipe for introducing cooling water into the pipe; and
a discharge duct housed in the support pole and connected to an outlet port of the pipe for discharging the cooling water from the pipe,

wherein the base plate defines an upper surface, a distance between the upper surface and the pipe is uniform, and a thickness of the deposition portion is thicker than a thickness of the base plate.

Assignees

• Kayamoto Takashi
• Takahara Gou
• Nhk Spring Co Ltd

Inventors

• Kayamoto Takashi
• Takahara Gou

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• F28F21/08

  of metal · CPC title

• H01L21/67109

  Electricity · mapped topic

• C23C24/04 Primary

  Impact or kinetic deposition of particles · CPC title