Magnesium-based composite member, heat radiation member, and semiconductor device

Patent metadata

Field	Value
Publication number	US-9556501-B2
Application number	US-201113635988-A
Country	US
Kind code	B2
Filing date	Mar 16, 2011
Priority date	Apr 2, 2010
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

First claim

The invention claimed is:

1. A magnesium-based composite member provided with a through hole through which a fastening member for attachment is to be inserted, comprising:
a substrate provided with a substrate hole through which said fastening member is to be inserted and composed of a composite material of SiC and a matrix metal which is any of magnesium and a magnesium alloy; and
a receiving portion attached to said substrate and composed of a metal material different from said matrix metal,
said receiving portion being provided with a receiving portion hole through which said fastening member is to be inserted, and at least a part of an inner circumferential surface of said through hole being formed from an inner circumferential surface of said receiving portion hole, and
in said matrix metal, said SiC is present in a form of a porous body having open pores, the open pores of the porous body are filled with the matrix metal.

2. The magnesium-based composite member according to claim 1 , wherein
said composite material has a network portion for bonding SiC to one another,
said substrate hole is provided in a region where said composite material has said network portion, and
said receiving portion is arranged such that a head portion of said fastening member is in contact therewith.

3. The magnesium-based composite member according to claim 1 , wherein
said composite material contains said SiC by more than 70 volume %.

4. The magnesium-based composite member according to claim 1 , wherein
said receiving portion has a metal plate arranged such that a head portion of said fastening member is in contact therewith, and
in such a state that said head portion is in contact with said metal plate as said fastening member is fastened, said metal plate extends to project from a periphery of said head portion in a plan view.

5. The magnesium-based composite member according to claim 4 , further comprising a metal coating layer for covering at least one surface of said substrate, wherein
a periphery of said metal plate is joined to said metal coating layer, and
one surface of said metal plate is exposed at said metal coating layer.

6. The magnesium-based composite member according to claim 4 , further comprising a cylindrical portion covering at least a part of an inner circumferential surface of said substrate hole and composed of a metal material identical in type to said metal material.

7. The magnesium-based composite member according to claim 4 , wherein
said metal plate has an area at least 10 percent greater than an area of the head portion of said fastening member in the plan view.

8. The magnesium-based composite member according to claim 1 , having a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 8 ppm/K and thermal conductivity not lower than 180 W/m·K.

9. A heat radiation member, formed from the magnesium-based composite member according to claim 1 .

10. A semiconductor device, comprising:
the heat radiation member according to claim 9 ; and
a semiconductor element mounted on said heat radiation member.

11. The magnesium-based composite member according to claim 1 ,
wherein in said matrix metal, said SiC is present in a form of being bonded by said network portion.

12. The magnesium-based composite member according to claim 11 , wherein
said substrate hole is provided in a region where said composite material has said network portion, and
said receiving portion is arranged such that a head portion of said fastening member is in contact therewith.

Assignees

• Iwayama Isao
• Nishikawa Taichiro
• Takaki Yoshiyuki
• Ikeda Toshiya
• Koyama Shigeki
• Sumitomo Electric Industries
• Almt Corp

Inventors

• Iwayama Isao
• Nishikawa Taichiro
• Takaki Yoshiyuki
• Ikeda Toshiya
• Koyama Shigeki

Classifications

• C22C47/06

  by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element · CPC title

• B22F3/11

  Making porous workpieces or articles · CPC title

• C22C23/00

  Alloys based on magnesium · CPC title

• Y10T428/12007

  Component of composite having metal continuous phase interengaged with nonmetal continuous phase · CPC title

• C22C29/065

  based on SiC · CPC title