Retinal prosthesis and method of manufacturing a retinal prosthesis

Patent metadata

Field	Value
Publication number	US-9555244-B2
Application number	US-201313901443-A
Country	US
Kind code	B2
Filing date	May 23, 2013
Priority date	Apr 28, 2005
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

First claim

What we claim is:

1. An implantable retinal prosthesis comprising:
a molded polymer body including a strap;
a hermetic electronics package mounted to the polymer body including:
a. a rigid base, including an electrically non-conductive substrate and a plurality of electrically conductive vias through the electrically non-conductive substrate,
b. an integrated circuit attached directly to the base and electrically connected to at least one of the plurality of electrically conductive vias,
c. a passive circuit within the hermetic electronics package; and
d. a rigid cover bonded to the base; and

a secondary inductive coil embedded within the molded polymer body wherein the molded polymer body holds the secondary inductive coil in adjacent and coplanar, but not coaxial, alignment with the hermetic electronics package, the secondary inductive coil electrically coupled to the electronics package and powering the circuits in the electronics package.

2. The implantable retinal prosthesis according to claim 1 , further comprising suture tabs connected to the molded polymer body.

3. The implantable retinal prosthesis according to claim 1 , further comprising a third circuit within the hermetic electronics package wire bonded to the base and electrically connected to at least one of the conductive vias.

4. The implantable retinal prosthesis according to claim 3 , wherein the third circuit is a wire bonded hybrid stack circuit, including thin film metallization, wire bonded directly to the base.

5. The implantable retinal prosthesis according to claim 1 , wherein the secondary inductive coil is a wound wire coil.

6. The implantable retinal prosthesis according to claim 1 , wherein the secondary inductive coil is oval shaped.

7. The implantable retinal prosthesis according to claim 1 , further comprising an electrode array electrically coupled to a plurality of the conductive vias.

8. The implantable retinal prosthesis according to claim 7 , wherein the electrode array is suitable for stimulating tissue.

9. The implantable retinal prosthesis according to claim 8 , wherein the electrode array and a cable connecting the electrode array to the hermetic electronics package comprise metal traces sandwiched between thin polymer films.

10. The implantable retinal prosthesis according to claim 9 , wherein the cable is bump bonded to the base with conductive bumps.

11. The implantable retinal prosthesis according to claim 10 , wherein the conductive bumps contain at least one conductive epoxy or polyimide.

12. The implantable retinal prosthesis according to claim 10 , wherein the conductive bumps are filled with one or more metals selected from a group consisting of silver, platinum, iridium, titanium, platinum alloys, iridium alloys, or titanium alloys or mixtures thereof.

13. The implantable retinal prosthesis according to claim 12 , wherein the metal or metal alloys are in dust, flake or powder form.

14. The implantable retinal prosthesis according to claim 1 , wherein the cover includes a ring and a lid with a lip engaging the ring to the lid.

15. The implantable retinal prosthesis according to claim 1 , wherein the electrically non-conductive substrate contains ceramic.

16. The implantable retinal prosthesis according to claim 15 , wherein the electrically conductive vias are a metallic and ceramic paste co-fired with the electrically non-conductive substrate to form a hermetic seal.

17. The implantable retinal prosthesis according to claim 1 , wherein the cover contains metal.

18. The implantable retinal prosthesis according to claim 1 , further comprising a polymer underfill under the integrated circuit.

19. The implantable retinal prosthesis according to claim 1 , further comprising a getter.

20. The implantable retinal prosthesis according to claim 19 , wherein the getter is placed on the inside of the cover.

Assignees

• Second Sight Medical Products Inc

Inventors

• Greenberg Robert J
• Ok Jerry
• Neysmith Jordan Matthew
• Wilkin Kevin
• Talbot Neil Hamilton
• Chang Da-Yu

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• A61N1/36046 Primary

  of the eye · CPC title

• A61N1/3758

  Packaging of the components within the casing · CPC title