Substrate processing device and substrate processing method

Patent metadata

Field	Value
Publication number	US-9553003-B2
Application number	US-201414212382-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 18, 2013
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.

First claim

What is claimed is:

1. A substrate processing device having a substrate cleaning chamber, a transportation robot, and a substrate drying chamber, wherein
the substrate cleaning chamber includes a first table holding and rotating a substrate in a manner to direct a surface with a pattern of the substrate upward, a cleaning liquid supply unit supplying a cleaning liquid to the upwardly directed surface of the rotating substrate, and a solvent supply unit supplying a volatile solvent to the surface of the substrate supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate with the volatile solvent,
the transportation robot is configured to take out the substrate processed in the substrate cleaning chamber from the substrate cleaning chamber, to invert the substrate to direct its surface with the pattern downward, and to supply the substrate to the substrate drying chamber,
the substrate drying chamber includes:
a second table holding the substrate which is supplied by the transportation robot so that the surface with the pattern of the substrate is directed downward,
a heating and drying unit provided below the second table, and having a lamp irradiating upward with light having a peak intensity in wavelengths between 500 nm and 3000 nm, and a protection cover located at an upper portion of the lamp for covering and protecting the lamp,
the heating and drying unit heating the surface of the substrate supplied with the volatile solvent in the substrate cleaning chamber, removing the volatile solvent from the surface of the substrate, and drying the surface of the substrate, and
a nozzle fixedly provided, between the downward-directed surface with the pattern of the substrate and the heating and drying unit, and, outside of the outer periphery of the heating and drying unit, so as to eject an inert gas to the protection cover from the outside of the protection cover.

2. The substrate processing device according to claim 1 , wherein
the heating and drying unit is provided with a reflector for improving an irradiation efficiency of the lamp.

3. The substrate processing device according to claim 1 , wherein
the nozzle is provided so as to penetrate a side wall of the substrate drying chamber.

4. The substrate processing device according to claim 3 , wherein a top end of the nozzle is bent toward the protection cover.

5. The substrate processing device according to claim 1 , wherein
the substrate drying chamber further having a second nozzle supplying an inert gas toward a space between the surface with the pattern of the substrate supported by the second table and a ceiling surface of the substrate drying chamber.

6. A substrate processing device having a substrate cleaning chamber, a transportation robot, and a substrate drying chamber, wherein
the substrate cleaning chamber includes a first table holding and rotating a substrate in a manner to direct a surface with a pattern of the substrate upward, a cleaning liquid supply unit supplying a cleaning liquid to the upwardly directed surface of the rotating substrate, and a solvent supply unit supplying a volatile solvent to the surface of the substrate supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate with the volatile solvent,
the transportation robot is configured to take out the substrate processed in the substrate cleaning chamber from the substrate cleaning chamber, to invert the substrate to direct its surface with the pattern downward, and to supply the substrate to the substrate drying chamber,
the substrate drying chamber includes:
a second table holding the substrate which is supplied by the transportation robot so that the surface with the pattern of the substrate is directed downward,
a heating and drying unit provided below the second table, and having a lamp irradiating upward with light having a peak intensity in wavelengths between 500 nm and 3000 nm,
the heating and drying unit heating the surface with the pattern of the substrate which is supplied with the volatile solvent in the substrate cleaning chamber, removing the volatile solvent from the surface with the pattern of the substrate, and drying the surface with the pattern of the substrate, and
a first blow-off nozzle fixedly provided, between the downward-directed surface with the pattern of the substrate and the heating and drying unit, and outside of the outer periphery of the substrate, so as to eject a gas toward the surface with the pattern of the substrate from the outside of the substrate.

7. The substrate processing device according to claim 6 , wherein the first blow-off nozzle is provided so as to penetrate a side wall of the substrate drying chamber.

8. The substrate processing device according to claim 7 , wherein a top end of the first blow-off nozzle is bent toward the substrate.

9. The substrate processing device according to claim 6 , wherein
the substrate drying chamber further having a second nozzle supplying an inert gas toward a space between the surface with the pattern of the substrate supported by the second table and a ceiling surface of the substrate drying chamber.

Assignees

• Shibaura Mechatronics Corp

Inventors

• Hayashi Konosuke
• Furuya Masaaki
• Ootagaki Takashi
• Nagashima Yuji
• Kinase Atsushi
• Abe Masahiro

Classifications

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0411 Primary

  for wet cleaning or washing · CPC title

• H01L21/67034

  Electricity · mapped topic