Electroless plating solution with at least two borane containing reducing agents

Patent metadata

Field	Value
Publication number	US-9551074-B2
Application number	US-201414297352-A
Country	US
Kind code	B2
Filing date	Jun 5, 2014
Priority date	Jun 5, 2014
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

First claim

What is claimed is:

1. A solution for providing electroless deposition of a metal layer on a substrate, comprising:
a solvent;
a metal precursor;
a first borane containing reducing agent; and
a second borane containing reducing agent, wherein the first borane containing reducing agent has a deposition rate of at least two times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

2. The solution, as recited in claim 1 , wherein the metal precursor comprises at least one of a cobalt precursor, a nickel precursor, a copper precursor, an iron precursor or a palladium precursor.

3. The solution, as recited in claim 2 , wherein the metal precursor comprises a mixture of a cobalt precursor and a molybdenum precursor.

4. The solution, as recited in claim 3 , wherein the solvent is at last one of dimethyl sulfoxide (DMSO), ethylene glycol, ionic liquids, or water.

5. The solution, as recited in claim 4 , wherein the solution further comprises at least one of a complexing agent, a surfactant, or a pH adjustment agent.

6. The solution, as recited in claim 5 , wherein the first borane containing reducing agent is at least one of tert-butylamine borane, ammonia borane, dimethylsulfide borane, or dimethylamine borane (DMAB) and the second borane containing reducing agent is morpholine borane.

7. The solution, as recited in claim 5 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.

8. The solution, as recited in claim 2 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.

9. The solution, as recited in claim 1 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.

10. A solution for providing electroless deposition of a metal layer on a substrate, comprising:
a solvent;
a metal precursor;
borane dimethylamine; and
morpholine borane.

11. The solution, as recited in claim 10 , wherein the metal precursor comprises at least one of a cobalt precursor, a nickel precursor, a copper precursor, an iron precursor or a palladium precursor.

12. The solution, as recited in claim 11 , wherein the metal precursor comprises a mixture of a cobalt precursor and a molybdenum precursor.

13. The solution, as recited in claim 12 , wherein the solvent is at last one of dimethyl sulfoxide (DMSO), ethylene glycol, ionic liquids, or water.

14. The solution, as recited in claim 1 , wherein the first borane containing reducing agent is at least one of tert-butylamine borane or dimethylsulfide borane and the second borane containing reducing agent is morpholine borane.

Assignees

• Lam Res Corp

Inventors

• Kolics Artur
• Nalla Praveen
• Bin Xiaomin
• Li Nanhai
• Wang Yaxin
• Little Patrick
• Polyanskaya Marina

Classifications

• H10P14/46 Primary

  using a liquid · CPC title

• C23C18/52

  using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50 · CPC title

• C23C18/50

  with alloys based on iron, cobalt or nickel · CPC title

• C23C18/44

  using reducing agents · CPC title

• C23C18/40

  using reducing agents · CPC title