Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same

Patent metadata

Field	Value
Publication number	US-9550931-B2
Application number	US-201414270843-A
Country	US
Kind code	B2
Filing date	May 6, 2014
Priority date	May 14, 2013
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A temporary adhesive material for a wafer includes a first temporary adhesive layer of a silicone-containing polymer layer containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer. Thereby, there can be formed a temporary adhesive layer having high thickness uniformity, even on a wafer having a step. Because of the thickness uniformity, a thin wafer having a uniform thickness of 50 μm or less can be easily obtained. When a thin wafer is produced and then delaminated from a support, the wafer can be delaminated from the support by exposure at a low exposure dose without stress. Therefore, a brittle thin wafer can be easily handled without causing damage, and a thin wafer can be easily produced.

First claim

The invention claimed is:

1. A temporary adhesive material for a wafer comprising a first temporary adhesive layer of a silicone-containing polymer layer (A) containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer (B) which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer (A), wherein the polymer in the polymer layer (B) is a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III):
(I) a siloxane unit represented by R 9 SiO 3/2 (T unit): 50 to 99 mol %;
(II) a siloxane unit represented by R 10 R 11 SiO 2/2 (D unit): 0 to 49 mol %; and
(III) a siloxane unit represented by R 12 3 SiO 1/2 (M unit): 1 to 15 mol %,
wherein, R 9 to R 12 represent a monovalent organic group, 50 to 80 mol % of all the organic groups represented by R 9 to R 11 represent the same or different non-aromatic saturated hydrocarbon groups having the following cyclic structures having 5 to 7 carbon atoms,

10 to 40 mol % of the organic groups represent the same or different substituted or unsubstituted monovalent acyclic saturated hydrocarbon groups having 6 to 15 carbon atoms, and groups other than the cyclic and acyclic saturated hydrocarbon groups in all the organic groups represented by R 9 to R 12 represent the same or different substituted or unsubstituted monovalent hydrocarbon groups having 1 to 5 carbon atoms.

2. The temporary adhesive material for a wafer according to claim 1 , wherein the polymer layer (A) contains a thermosetting modified siloxane polymer including a silphenylene-containing polymer compound which has a weight average molecular weight of 3,000 to 500,000 and a repeating unit represented by the following general formula (1),

wherein, R 1 to R 4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” represents an integer of 1 to 100; A represents a positive number; B represents 0 or a positive number; A+B=1; and X represents a divalent organic group represented by the following general formula (3),

wherein, Z represents a divalent organic group selected from any of

“n” represents 0 or 1; R 5 and R 6 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “k” represents any one of 0, 1, and 2, or
an epoxy-containing silicone polymer compound which has a weight average molecular weight of 3,000 to 500,000 and a repeating unit represented by the following general formula (2),

wherein, R 1 to R 4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” is an integer of 1 to 100; “a”, “b”, “c” and “d” each are 0 or a positive number; and a+b+c+d=1, provided that “c” and “d” are not equal to 0 at the same time, and 0<(c+d)/(a+b+c+d)≦1.0; X represents a divalent organic group represented by the following general formula (3),

wherein, Z represents a divalent organic group selected from any of

“n” represents 0 or 1; R 5 and R 6 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “k” represents any one of 0, 1, and 2, and Y represents a divalent organic group represents by the following general formula (4),

wherein, V represents a divalent organic group selected from any of

“p” represents 0 or 1; R 7 and R 8 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “h” represents any one of 0, 1, and 2.

3. The temporary adhesive material for a wafer according to claim 2 , wherein the photo base generator in the polymer layer (A) is represented by the following general formula (6),

wherein, R 16 and R 17 independently represent a hydrogen atom or an organic group, or R 16 and R 17 may be bonded to each other to form a nitrogen-containing aliphatic ring or a nitrogen-containing aromatic ring which has 3 to 8 carbon atoms and may have a substituent and a heteroatom, together with a nitrogen atom to which they are bonded; R 18 and R 19 each independently represent a hydrogen atom, a halogen atom, a hydroxy group, a mercapto group, a nitro group, a silyl group, a silanol group, or an organic group; R 20 , R 21 , R 22 , R 23 , and R 24 each independently represent a hydrogen atom, a halogen atom, a hydroxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulphonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or an organic group, and may be the same or different, or two or more of R 20 , R 21 , R 22 , R 23 , and R 24 may be bonded to each other to form a cyclic structure or have a bond to a heteroatom.

4. The temporary adhesive material for a wafer according to claim 1 , wherein the polymer layer (A) is a cured layer of a composition containing a thermosetting modified siloxane polymer including a silphenylene-containing polymer compound which has a weight average molecular weight of 3,000 to 500,000 and a repeating unit represented by the following general formula (1),

wherein, R 1 to R 4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” represents an integer of 1 to 100; A represents a positive number; B represents 0 or a positive number; A+B=1; and X represents a divalent organic group represented by the following general formula (3),

wherein, Z represents a divalent organic group selected from any of

“n” represents 0 or 1; R 5 and R 6 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “k” represents any one of 0, 1, and 2, or
an epoxy-containing silicone polymer compound which has a weight average molecular weight of 3,000 to 500,000 and a repeating unit represented by the following general formula (2),

wherein, R 1 to R 4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” is an integer of 1 to 100; “a”, “b”, “c” and “d” each are 0 or a

Assignees

• Shinetsu Chemical Co

Inventors

• Yasuda Hiroyuki
• Sugo Michihiro

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title