Room-temperature-curable resin composition

Patent metadata

Field	Value
Publication number	US-9434817-B2
Application number	US-201414916355-A
Country	US
Kind code	B2
Filing date	Jul 10, 2014
Priority date	Oct 10, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

The invention is a room-temperature-curable resin composition including a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1). This provides a room-temperature-curable resin composition which is curable in short time, free from generation of an odor due to the catalyst, free from a heavy environmental load; and has sufficient hardness, elongation at shear, and tensile strength after curing.

First claim

The invention claimed is:

1. A room-temperature-curable resin composition comprising a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1),

wherein, “R” represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “R 1 ” and “R 2 ” may be the same or different and represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “A” represents a single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms, “Y” represents a hydrolysable group, and “n” is an integer satisfying 0≦n≦3.

2. The room-temperature-curable resin composition according to claim 1 , wherein the composition comprises an organopolysiloxane.

3. The room-temperature-curable resin composition according to claim 2 , wherein the composition comprises:
(A) 0.001 to 20 parts by mass of the phosphazene skeleton-containing organosilicon compound shown by the foregoing general formula (1);
(B) 100 parts by mass of the organopolysiloxane;
(C) 0 to 15 parts by mass of a curing catalyst except for the component (A);
(D) 0 to 30 parts by mass of either or both of hydrolysable silane and a partial hydrolysis-condensate thereof except for the component (A);
(E) 0 to 1,000 parts by mass of a filler; and
(F) 0 to 30 parts by mass of an adhesion promoter.

4. The room-temperature-curable resin composition according to claim 1 , wherein the composition is used for any of a coating agent, an adhesive, and a sealant.

5. The room-temperature-curable resin composition according to claim 2 , wherein the composition is used for any of a coating agent, an adhesive, and a sealant.

6. The room-temperature-curable resin composition according to claim 3 , wherein the composition is used for any of a coating agent, an adhesive, and a sealant.

Assignees

• Shinetsu Chemical Co

Inventors

• KATAYAMA Taiki
• Sakamoto Takafumi

Classifications

• C09D183/14

  in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title

• C07F9/065

  Phosphoranes containing the structure P=N- · CPC title

• C08G77/08 Primary

  characterised by the catalysts used · CPC title

• C09K3/1018

  Macromolecular compounds having one or more carbon-to-silicon linkages · CPC title

• C07F9/224

  Phosphorus triamides · CPC title