Reduced expansion thermal compression bonding process bond head

Patent metadata

Field	Value
Publication number	US-9548284-B2
Application number	US-201314132812-A
Country	US
Kind code	B2
Filing date	Dec 18, 2013
Priority date	Dec 18, 2013
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

First claim

What is claimed is:

1. A thermal compression bonding process bond head comprising:
a heater;
a cooling block configured to conduct heat from the heater; and
a thermal expansion coefficient compensating structure coupled to a portion of the cooling block and configured to couple the cooling block to the heater such that there is no direct interface between the cooling block and the heater, wherein the thermal expansion coefficient compensating structure comprises a plurality of annular rings including a first annular ring having a first coefficient of thermal expansion and a second annular ring having a second coefficient of thermal expansion wherein the first coefficient of thermal expansion is different than the second coefficient of thermal expansion.

2. The thermal compression bonding process bond head of claim 1 wherein the cooling block comprises a recess surrounding a lower periphery wherein the thermal expansion coefficient compensating structure is coupled to the cooling block within the recess.

3. The thermal compression bonding process bond head of claim 1 wherein the thermal expansion coefficient compensating structure is coupled to the cooling block with a first sealant and to the heater with a second sealant.

4. The thermal compression bonding process bond head of claim 1 wherein the thermal expansion coefficient compensating structure comprises a material having a negative coefficient of thermal expansion.

5. The thermal compression bonding process bond head of claim 4 wherein the material having the negative coefficient of thermal expansion comprises one of: zirconium tungstate, Siliceous Faujasite, or glasses in a titania-silica family.

6. The thermal compression bonding process bond head of claim 1 wherein the plurality of annular rings comprise:
the first annular ring coupled to the heater with a first sealant; and
the second annular ring coupled to the first annular ring with a second sealant and to the cooling block with a third sealant.

7. The thermal compression bonding process bond head of claim 1 wherein the cooling block has a recess surrounding a lower periphery and the plurality of annular rings comprise:
the first annular ring coupled to the heater substantially vertically within the recess; and
the second annular ring coupled between a top of the first annular ring and a bottom of the cooling block within the recess.

8. A thermal compression bonding process bond head comprising:
a heater;
a cooling block configured to conduct heat from the heater; and
a thermal expansion coefficient compensating structure coupled to a portion of the cooling block and configured to couple the cooling block to the heater such that there is no direct interface between the cooling block and the heater, wherein the thermal expansion coefficient compensating structure comprises a plurality of annular rings including a first annular ring coupled to the heater with a first sealant and having a first coefficient of thermal expansion and a second annular ring having a second coefficient of thermal expansion wherein the first coefficient of thermal expansion is less than the second coefficient of thermal expansion.

Assignees

• Intel Corp

Inventors

• Malatkar Pramod
• Dhavaleswarapu Hemanth
• Neeb James

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title