Semiconductor device

Patent metadata

Field	Value
Publication number	US-9543227-B2
Application number	US-201315023870-A
Country	US
Kind code	B2
Filing date	Dec 27, 2013
Priority date	Dec 27, 2013
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A semiconductor device ( 10 ) includes a metallic base plate ( 22 ) provided with an upper surface ( 22 a ) and a lower surface ( 22 b ), a plurality of insulating substrates ( 24 ) provided on the upper surface ( 22 a ), and a plurality of semiconductor elements ( 26 ) and ( 28 ) mounted side by side on the respective insulating substrates ( 24 ). Annular grooves ( 50 ) and ( 52 ) for storing insulating grease are provided on the lower surface ( 22 b ) of the base plate ( 22 ). A surface ( 40 a ) of a cooling fin ( 40 ) is superimposed on the lower surface ( 22 b ) with insulating grease ( 42 ) interposed therebetween and insides of the annular grooves ( 50 ) and ( 52 ) are filled with the insulating grease ( 42 ).

First claim

The invention claimed is:

1. A semiconductor device comprising:
a base plate having an upper surface and a lower surface; and
a plurality of planar semiconductor elements provided side by side on the upper surface side,
wherein the lower surface of the base plate is provided with a groove region where a plurality of grooves are continuously provided so as to spread and overlap with the plurality of semiconductor elements, grooves of the groove region in the center of the base plate are deeper than grooves of the groove region on distal end sides of the base plate.

2. The semiconductor device according to claim 1 , further comprising a cooling fin having a flat surface, the flat surface being superimposed on the lower surface,
wherein insulating grease is provided between the lower surface and the flat surface, and
a sealing member is provided so as to seal the insulating grease along an edge of the base plate.

3. The semiconductor device according to claim 1 , wherein a semiconductor material of the semiconductor element is silicon carbide.

Assignees

• Mitsubishi Electric Corp

Inventors

• Yoshimura Koichi
• Kurachi Kazuhiro

Classifications

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/235

  attached to package parts · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/658

  for devices provided for in groups H10D8/00 - H10D48/00 · CPC title