System to improve an in-line memory module

Patent metadata

Field	Value
Publication number	US-9537237-B2
Application number	US-201314106824-A
Country	US
Kind code	B2
Filing date	Dec 15, 2013
Priority date	Sep 24, 2009
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

First claim

What is claimed is:

1. A system comprising:
an in-line memory module including a printed circuit board and a plurality of heat sources, the printed circuit board including a plurality of through holes;
an edging carried by the in-line memory module along three edges of the in-line memory module, the edging including mounting features at opposing sides of the edging, the mounting features positioned to join the edging to the in-line memory module at the through holes, the edging configured to at least one of stiffen, support, protect, and aid in handling the in-line memory module;
retention bars secured to the in-line memory module at the through holes;
locator dowels aligning the edging and the retention bars with the in-line memory module at the through holes such that the retention bars are secured to a back surface of the in-line memory module and the edging is secured to a front surface of in-line memory module opposite the back surface; and
a guide rib carried by said edging to facilitate positioning of the in-line memory module during installation.

2. The system of claim 1 wherein said edging comprises a low profile design to reduce air flow impedance.

3. The system of claim 1 wherein said edging comprises flares that control the in-line memory module's installation.

4. The system of claim 1 wherein said edging comprises a mounting feature to join said edging to the in-line memory module.

5. The system of claim 1 wherein said edging comprises a mounting guidance element to align said edging during joining to the in-line memory module.

6. The system of claim 1 wherein said edging comprises a retainer that secures the in-line memory module after its installation.

7. The system of claim 1 wherein the in-line memory module comprises at least one of random access memory, application-specific integrated circuit, surface mount components, and heat sink.

Assignees

• IBM

Inventors

• Brandon Mark A
• Canfield Shawn
• Edwards David L
• Genest Robert R
• Kemink Randall G
• Mullady Robert K
• Torok John G

Classifications

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K2201/10159

  Memory · CPC title

• H01R12/721

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H01R12/7029 Primary

  not integral with the coupling device · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title