Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

Patent metadata

Field	Value
Publication number	US-9106027-B2
Application number	US-201213724056-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Dec 21, 2012
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.

First claim

What is claimed is:

1. An apparatus for mounting a parallel optical communications module in a plane of a mounting surface of a host circuit board (CB), the apparatus comprising:
a socket configured to interface a parallel optical communications module with a host CB, the socket having first and second cut away areas formed in opposing bottom edges of the socket;
first and second lugs mechanically coupled to opposing outer surfaces of the socket such that inwardly curved portion…

Assignees

• Avago Technologies General Ip

Inventors

• Chan Seng-Kum
• Arekar Chaitanya
• Xu Hui

Classifications

• H01R12/7029 Primary

  Electricity · mapped topic

• H05K3/301

  Electricity · mapped topic

• Y10T29/4913

  Cross-Sectional Technologies · mapped topic

• H05K2201/10121

  Electricity · mapped topic

• H05K2201/10325

  Electricity · mapped topic