Optoelectronic component with a wireless contacting

US9537070B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9537070-B2
Application numberUS-66430405-A
CountryUS
Kind codeB2
Filing dateSep 13, 2005
Priority dateSep 30, 2004
Publication dateJan 3, 2017
Grant dateJan 3, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optoelectronic component contains a semiconductor chip ( 1 ) and a carrier body ( 10 ), which are provided with a transparent, electrically insulating encapsulation layer ( 3 ), the encapsulation layer ( 3 ) having two cutouts ( 11, 12 ) for uncovering a contact area ( 6 ) and a connection region ( 8 ) of the carrier body, and an electrically conductive layer ( 14 ) being led from the contact area ( 6 ) over a partial region of the encapsulation layer ( 3 ) to the electrical connection region ( 8 ) of the carrier body ( 10 ) in order to electrically connect the contact area ( 6 ) and the electrical connection region ( 8 ) to one another. The radiation emitted in a main radiation direction ( 13 ) by the semiconductor chip ( 1 ) is coupled out through the encapsulation layer ( 3 ), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.

First claim

Opening claim text (preview).

The invention claimed is: 1. An optoelectronic component which emits radiation in a main radiation direction, comprising: a semiconductor chip having a first main area, a first contact area, and a second main area, opposite the first main area, with a second contact area; a carrier body having first and second electrical connection regions insulated from one another, the semiconductor chip being fixed by the first main area on the carrier body and the first contact area being el…

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Frequently asked questions

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What does patent US9537070B2 cover?
An optoelectronic component contains a semiconductor chip ( 1 ) and a carrier body ( 10 ), which are provided with a transparent, electrically insulating encapsulation layer ( 3 ), the encapsulation layer ( 3 ) having two cutouts ( 11, 12 ) for uncovering a contact area ( 6 ) and a connection region ( 8 ) of the carrier body, and an electrically conductive layer ( 14 ) being led from the contac…
Who is the assignee on this patent?
Guenther Ewald Karl Michael, Sorg Jörg Erich, Stath Norbert, and 1 more
What technology area does this patent fall under?
Primary CPC classification H01L33/62. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).