Interconnection joints having variable volumes in package structures and methods of formation thereof

Patent metadata

Field	Value
Publication number	US-9536865-B1
Application number	US-201514807225-A
Country	US
Kind code	B1
Filing date	Jul 23, 2015
Priority date	Jul 23, 2015
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

An embodiment method includes analyzing warpage characteristics of a first package component and a second package component and forming a plurality of solder paste elements on the first package component. A volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component. The method further includes aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component and bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.

First claim

What is claimed is:

1. A method comprising:
analyzing warpage characteristics of a first package component and a second package component;
forming a plurality of solder paste elements on the first package component, wherein a volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component, and wherein a first volume of a first one of the plurality of solder paste elements is different from a second volume of a second one of the plurality of solder paste elements;
aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component; and
bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.

2. The method of claim 1 , wherein forming the plurality of solder paste elements comprises a stencil printing process using a stencil comprising a plurality of through-holes.

3. The method of claim 2 , further comprising selecting a size for each of the plurality of through-holes based on the warpage characteristics of the first package component and the second package component.

4. The method of claim 1 wherein analyzing the warpage characteristics of the first package component and the second package component comprises estimating a distance between the first package component and the second package components at various areas after bonding the second package component to the first package component.

5. The method of claim 4 , wherein forming the plurality of solder paste elements comprises:
forming a first solder paste element having a first volume at a first area of the first package component; and
forming a second solder paste element having a second volume at a second area of the first package component, wherein the first volume is greater than the second volume, and wherein an estimated distance between the first package component and the second package component is larger in the first area than in the second area.

6. The method of claim 1 , wherein analyzing the warpage characteristics comprises taking Moiré measurements of sample package components having a same configuration as the first package component and the second package component.

7. The method of claim 1 , wherein the first package component is a fan-out wafer, and wherein the second package component is a device die.

8. The method of claim 1 further comprising after reflowing the plurality of connectors and the plurality of solder paste elements, forming an underfill between the first package component and the second package component.

9. A method comprising:
analyzing a warpage characteristic of a first package component, wherein analyzing the warpage characteristic comprises estimating distances between the first package component and a second package component when the first package component is bonded to the second package component;
configuring a solder paste stencil based on the warpage characteristic of the first package component; and
forming a plurality of solder paste elements on a surface of the first package component by stencil printing using the solder paste stencil, wherein the plurality of solder paste elements is non-uniform in size.

10. The method of claim 9 , further comprising:
aligning a plurality of solder balls on the second package component to the plurality of solder paste elements; and
reflowing the plurality of solder balls and the plurality of solder paste elements to form a plurality of connectors bonding the first package component to the second package component, wherein the plurality of connectors is non-uniform in size.

11. The method of claim 10 , wherein the solder paste stencil comprises a plurality of through-holes, wherein the method further comprising wherein configuring the solder paste stencil comprises selecting a size for each of the plurality of through-holes based on the warpage characteristic of the first package component.

12. The method of claim 11 , wherein selecting the size for each of the plurality of through-holes based on the warpage characteristic of the first package component comprises selecting a larger size for a first through-hole disposed in at a first location than for a second through-hole disposed at a second location, and wherein a distance between the first package component and the second package component is greater at the first location than at the second location.

13. The method of claim 9 further comprising using one or more solder paste stencils having a same configuration as the solder paste stencil to form solder paste elements on a plurality of first package components, wherein each of the plurality of first package components comprises a same configuration as the first package component.

14. The method of claim 13 further comprising bonding each of the plurality of first package components to a respective one of a plurality of second package components, wherein each of the plurality of second package components comprises a same configuration as the second package component.

15. The method of claim 9 further comprising forming a plurality of additional solder paste elements on a surface of a third package component using an additional solder paste stencil, wherein the third package component comprises a different configuration than the first package component, and wherein the additional solder paste stencil comprises a different configuration than the solder paste stencil.

16. The method of claim 9 wherein analyzing the warpage characteristics of the first package component comprises generating a topographical plot of a sample package component having a same configuration as the first package component.

17. A method comprising:
forming first solder paste elements on a surface of a first package component using a first stencil;
bonding a second package component to the first package component, wherein the first stencil has a first configuration in accordance with estimated warpage characteristics of the first package component and the second package component;
forming second solder paste elements on a surface of a third package component using a second stencil having a second configuration different from the first configuration; and
bonding a fourth package component to the third package component, wherein the second configuration is in accordance with estimated warpage characteristics of the third package component and the fourth package component.

18. The method of claim 17 , wherein the first solder paste elements are non-uniform in size.

19. The method of claim 17 further comprising estimating warpage characteristics of the first package component and the second package component by taking Moiré measurements of a first sample package component and a second sample package component, wherein the first sample package component has a same configuration as the first package component, and wherein the second sample package component has a same configuration as the second package component.

20. The method of claim 17 , wherein bonding the second package component to the first package component comprises reflowing a plurality of connectors with the first solder paste elements, and wherein the plurality of connectors are disposed on the second package component and are substantially uniform in size.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Kuo Hsuan-Ting
• Liu Chung-Shi
• Lin Hsiu-Jen
• Chen Hsien-Wei
• Cheng Ming-Da
• Chen Wei-Yu
• Tsao Chih-Chiang

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title