Use of ion beam etching to generate gate-all-around structure

Patent metadata

Field	Value
Publication number	US-9536748-B2
Application number	US-201414520070-A
Country	US
Kind code	B2
Filing date	Oct 21, 2014
Priority date	Oct 21, 2014
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

Various embodiments herein relate to methods and apparatus for performing anisotropic ion beam etching to form arrays of channels. The channels may be formed in semiconductor material, and may be used in a gate-all-around device. Generally speaking, a patterned mask layer is provided over a layer of semiconductor material. Ions are directed toward the substrate while the substrate is positioned in two particular orientations with respect to the ion trajectory. The substrate switches between these orientations such that ions impinge upon the substrate from two opposite angles. The patterned mask layer shadows/protects the underlying semiconductor material such that the channels are formed in intersecting shadowed regions.

First claim

What is claimed is:

1. A method of forming channels or nanowires for a gate-all-around device or other electronic device, the method comprising:
(a) providing a substrate on a substrate holder in a reaction chamber, the substrate comprising a patterned mask layer over semiconductor material, wherein the patterned mask layer comprises a plurality of linear mask portions oriented substantially parallel to one another;
(b) orienting the substrate with respect to an ion trajectory in a first orientation and directing ions toward the substrate in a first direction, wherein the ions impact the substrate at a first incidence angle to thereby anisotropically etch the semiconductor material to form a first set of trenches;
(c) orienting the substrate with respect to the ion trajectory in a second orientation and directing ions toward the substrate in a second direction, wherein the ions impact the substrate at a second incidence angle to thereby anisotropically etch the semiconductor material to form a second set of trenches;
(d) repeating (b)-(c) to further etch the first and second sets of trenches to form the channels or nanowires in a direction parallel to the plurality of linear mask portions; and
(e) forming the gate-all-around device, wherein the channels or nanowires formed in (a)-(c) are channels or nanowires in the gate-all-around device.

2. The method of claim 1 , wherein an array of channels or nanowires is formed, the array comprising at least two rows of channels or nanowires.

3. The method of claim 1 , wherein the ions are delivered in the form of a plurality of ion beams that have a divergence of about 3° or less.

4. The method of claim 3 , wherein the ions are delivered in the form of a plurality of ion beams that have a divergence of about 1° or less, and wherein an array of channels or nanowires is formed, the array comprising at least three rows of channels or nanowires.

5. The method of claim 1 , further comprising translating the substrate while the ions are exposed to the substrate in (b) and (c).

6. The method of claim 1 , further comprising ceasing the flux of the ions while the orientation of the substrate with respect to the ion trajectory is switched.

7. The method of claim 1 , wherein the first direction and second direction are each perpendicular to the length of the linear mask portions.

8. The method of claim 7 , wherein the first direction and second direction are substantially opposite one another.

9. The method of claim 8 , wherein the first and second incidence angles are substantially equal and opposite one another.

10. The method of claim 1 , further comprising delivering a reactive etchant to the surface of the substrate during (b) and during (c).

11. The method of claim 10 , wherein the reactive etchant comprises a gas selected from the group consisting of H 2 , O 2 , H 2 O, F 2 , CH 4 , CF 4 , C 2 F 6 , BF 3 , NH 3 , NO, NO 2 , SF 6 , N 2 , N 2 O, BCl 3 , CHF 3 , CH 2 F 2 , C 2 H 4 Cl 2 , HCl, Cl 2 , Br 2 , HBr, methanol, ethanol, propanol, butanol, methylene glycol, ethylene glycol, acetylacetone, acetic acid, formic acid, hexafluoroacetylacetone, ketones, amines, esters, and combinations thereof.

12. The method of claim 10 , wherein the reactive etchant is provided along with an inert gas, and wherein the inert gas is used to generate a plasma from which the ions are extracted.

13. The method of claim 10 , wherein (b) and (c) each comprise cyclically performing the steps of: delivering the reactive etchant to the surface of the substrate, and exposing the surface of the substrate to the ions.

14. The method of claim 13 , wherein at least two cycles of reactant delivery and ion exposure are performed each time the orientation of the substrate with respect to the ion trajectory is switched.

15. The method of claim 10 , wherein the reactive etchant comprises ions of a material selected from the group consisting of: H, O, F, Cl, Br, I, BF 2 , BCl 2 , and combinations thereof.

16. The method of claim 1 , wherein the orientation of the substrate with respect to the ion trajectory is switched at least about 2 times during formation of the channels or nanowires.

17. The method of claim 1 , further comprising after (d), etching the channels or nanowires to make the channels or nanowires more round.

18. The method of claim 17 , further comprising removing the patterned mask layer; depositing sacrificial material surrounding the channels or nanowires; performing an isotropic etch to remove additional semiconductor material positioned under the channels or nanowires, and performing an etch to remove the sacrificial material surrounding the channels or nanowires.

19. The method of claim 18 , further comprising after the sacrificial material is removed, depositing dielectric material to coat the channels or nanowires, and depositing a gate structure around the coated channels or nanowires to form a gate-all-around device.

20. The method of claim 1 , wherein orienting the substrate with respect to the ion trajectory in (b) and/or (c) comprises (i) changing the orientation of the substrate, and/or (ii) changing the orientation of the ion trajectory.

21. The method of claim 1 , wherein an array of channels or nanowires is formed, the array comprising at least three rows of channels or nanowires.

22. A method of forming channels or nanowires for a gate-all-around device or other electronic device, the method comprising:
(a) providing a substrate on a substrate holder in a reaction chamber, the substrate comprising a patterned mask layer over semiconductor material, wherein the patterned mask layer comprises a plurality of linear mask portions oriented substantially parallel to one another;
(b) orienting the substrate with respect to an ion trajectory in a first orientation and directing ions toward the substrate in a first direction, wherein the ions impact the substrate at a first incidence angle to thereby anisotropically etch the semiconductor material to form a first set of trenches;
(c) orienting the substrate with respect to the ion trajectory in a second orientation and directing ions toward the substrate in a second direction, wherein the ions impact the substrate at a second incidence angle to thereby anisotropically etch the semiconductor material to form a second set of trenches; and
(d) repeating (b)-(c) to further etch the first and second sets of trenches to form the channels or nanowires in a direction parallel to the plurality of linear mask portions, wherein the ions are delivered in the form of a plurality of ion beams that have a divergence of about 1° or less, and wherein an array of channels or nanowires is formed, the array comprising at least three rows of channels or nanowires.

23. The method of claim 22 , wherein an array of channels or nanowires is formed, the array comprising at least two rows of channels or nanowires.

24. The method of claim 22 , further comprising translating the substrate while the ions are exposed to the substrate in (b) and (c).

25. The method of claim 22 , further comprising ceasing the flux of the ions while the orientation of the substrate with respect to the ion trajectory is switched.

26. A method of forming channels or nanowires for a gate-all-around device or other electronic device, the method comprising:
(a) providing a substrate on a substrate holder in a reaction chamber, the substrate comprising a patterned mask layer over se

Assignees

• Lam Res Corp

Inventors

• Berry Iii Ivan L
• Lill Thorsten

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10P50/693

  characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane · CPC title

• H10P50/691

  for Group V materials or Group III-V materials · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J2237/3151

  Etching · CPC title