Lift-off method

Patent metadata

Field	Value
Publication number	US-9531154-B2
Application number	US-201514798011-A
Country	US
Kind code	B2
Filing date	Jul 13, 2015
Priority date	Jul 14, 2014
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

In an optical device wafer, an optical device layer is formed over a front surface of an epitaxy substrate with the intermediary of a buffer layer composed of a Ga compound containing Ga. After a transfer substrate is joined to the optical device layer of the optical device wafer, a separation layer is formed at a boundary surface between the epitaxy substrate and the buffer layer by performing irradiation with a pulsed laser beam having such a wavelength as to be transmitted through the epitaxy substrate and be absorbed by the buffer layer from a back surface side of the epitaxy substrate. Thereafter, an ultrasonic horn that oscillates ultrasonic vibration is brought into contact with an outer circumferential part of the epitaxy substrate to vibrate the epitaxy substrate, and the epitaxy substrate is separated from the transfer substrate to transfer the optical device layer to the transfer substrate.

First claim

What is claimed is:

1. A lift-off method for transferring, to a transfer substrate, an optical device layer of an optical device wafer in which the optical device layer is formed over a front surface of an epitaxy substrate with intermediary of a buffer layer composed of a Ga compound containing Ga, the lift-off method comprising:
a transfer substrate joining step of joining the transfer substrate to a surface of the optical device layer of the optical device wafer with intermediary of a joining metal layer;
a separation layer forming step of forming a separation layer at a boundary surface between the epitaxy substrate and the buffer layer by performing irradiation with a pulsed laser beam having such a wavelength as to be transmitted through the epitaxy substrate and be absorbed by the buffer layer from a back surface side of the epitaxy substrate of the optical device wafer to which the transfer substrate is joined; and
an optical device layer transfer step of, after the separation layer forming step is carried out, bringing an ultrasonic horn that oscillates ultrasonic vibration into contact with the epitaxy substrate to vibrate the epitaxy substrate and separating the epitaxy substrate from the transfer substrate to transfer the optical device layer to the transfer substrate, wherein the ultrasonic horn is brought into contact with an outer circumferential part of the epitaxy substrate in the optical device layer transfer step,
wherein the outer peripheral part of the epitaxy substrate includes an upwardly curved surface as a result of warpage, and
wherein said ultrasonic horn includes a contact surface comprised of a downward-convex curved surface that is configured and arranged for making line contact or surface contact with the upwardly curved surface of the outer part of the epitaxy substrate.

2. The lift-off method according to claim 1 , wherein the ultrasonic horn is brought into contact only with the outer circumferential part of the epitaxy substrate in the optical device layer transfer step.

Assignees

• Disco Corp

Inventors

• Koyanagi Tasuku

Classifications

• H10P95/112

  leaving a reusable substrate, e.g. epitaxial lift off · CPC title

• Y10T156/1121

  Using vibration during delaminating · CPC title

• Y10T156/1158

  Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.] · CPC title

• Y10T156/1922

  Vibrating delaminating means · CPC title

• B32B43/006

  Delaminating · CPC title