High temperature biasable heater with advanced far edge electrode, electrostatic chuck, and embedded ground electrode
US-2024412957-A1 · Dec 12, 2024 · US
Stage heater and method of manufacturing shaft
US9524888B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9524888-B2 |
| Application number | US-201113695647-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 19, 2011 |
| Priority date | May 7, 2010 |
| Publication date | Dec 20, 2016 |
| Grant date | Dec 20, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.
First claim
Opening claim text (preview).
The invention claimed is: 1. A stage heater comprising: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate, wherein the shaft includes a pipe made of a metal having a lower heat conductivity than a material of the heating substrate, and a bonding layer formed on a side of the pipe to be bonded to the heating substrate, the bonding layer being formed by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon, wherein the bonding layer adheres tightly to the pipe by anchor effect, and wherein a thickness of the bonding layer along a longitudinal direction or along a radius direction where the bonding layer is bonded to the heating substrate is 50 to 5% of a thickness of the pipe. 2. The stage heater according to claim 1 , wherein the bonding layer is formed on an end surface of the pipe on the side to be bonded to the heating substrate. 3. The stage heater according to claim 1 , wherein the bonding layer is formed on an outer periphery of the pipe. 4. The stage heater according to claim 1 , wherein the pipe is made of any one material of stainless steel, titanium, and titanium alloy.
Assignees
Inventors
Classifications
characterised by the construction of the shaft · CPC title
- H10P72/0432Primary
mainly by conduction · CPC title
for supporting or gripping · CPC title
Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9524888B2 cover?
- A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat c…
- Who is the assignee on this patent?
- Kayamoto Takashi, Hirano Satoshi, Nhk Spring Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).