Polymer powder, curable resin composition and cured material thereof

Patent metadata

Field	Value
Publication number	US-9522997-B2
Application number	US-201514931431-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Dec 21, 2011
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A polymer powder (P) selected from a group consisting of (i) a polymer powder (P1) and (ii) a polymer powder (P2) is provided. The (i) polymer powder (P1) includes a (meth)acrylate-based polymer (A1) having a glass transition temperature of 0° C. or less, and the polymer powder has an acetone-soluble component of 5 mass % or more. The acetone-soluble component has a mass average molecular weight of 100,000 or more. The (ii) polymer powder (P2) has an acetone-soluble component of 2 mass % to 35 mass %, the acetone-soluble component has a mass average molecular weight of 100,000 or more, and has a volume average primary particle size (Dv) of 200 nm or more.

First claim

What is claimed is:

1. A polymer powder (P1) comprising a (meth)acrylate-based polymer (A1) having a glass transition temperature of 0° C. or less, where the polymer powder has an acetone-soluble component of 5 mass % or more, the acetone-soluble component having a mass average molecular weight of 100,000 or more,
wherein
the particles of the polymer powder have a size of 10 μm or less in an amount of less than 30 vol % when subjected to disintegration steps (1)-(3):
(1) diluting the polymer powder (P1) with ion exchanged water;
(2) performing supersonic irradiation at a frequency of 42 kHz and a power of 40 W for 5 minutes; and
(3) determining particle size distribution through particle size distribution measurement by laser diffractive/scattering.

2. The polymer powder (P1) according to claim 1 , further comprising a polymer (B1) having a glass transition temperature of more than 0° C.

3. The polymer powder (P1) according to claim 2 , wherein the polymer (B1) is a (meth)acrylate-based polymer.

4. The polymer powder (P1) according to claim 2 , wherein a content of the (meth)acrylate-based polymer (A1) having the glass transition temperature of 0° C. or less is 30 mass % to 90 mass %, and a content of the polymer (B1) is 70 mass % to 10 mass % with a total of 100 mass %.

5. The polymer powder (P1) according to claim 1 , wherein the polymer powder (P1) is a (meth)acrylate-based polymer powder obtained by polymerizing a monomer mixture (b1) in presence of the (meth)acrylate-based polymer (A1) and powderizing, wherein the (meth)acrylate-based polymer (A1) has the glass transition temperature of 0° C. or less, and the (meth)acrylate-based polymer powder has an acetone-soluble component of 5 mass % or more, and the acetone-soluble component has a mass average molecular weight of 100,000 or more.

6. A stress relaxation agent and pre-gelling agent for a curable resin composition, comprising the polymer powder (P1) according to claim 1 .

7. The stress relaxation agent and pre-gelling agent according to claim 6 , wherein the curable resin composition is obtained by adding 20 parts by mass of the polymer powder (P1) relative to 100 parts by mass of the curable resin, and a ratio (G′B/G′A) of storage elastic modulus G′A at a gelling temperature of −20° C. to storage elastic modulus G′B at a gelling temperature of +20° C. for the curable resin composition is 10 or more.

8. A curable resin composition, comprising the polymer powder (P1) according to claim 1 and a curable resin.

9. The curable resin composition according to claim 8 , wherein the curable resin is an epoxy resin.

10. A cured material, obtained by curing the curable resin composition according to claim 8 .

11. A sealing material for semiconductors, comprising the cured resin composition according to claim 10 .

12. A sealing agent for liquid crystal display devices, comprising the cured resin composition according to claim 10 .

Assignees

• Mitsubishi Rayon Co

Inventors

• Hatae Youko
• Kasai Toshihiro

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W72/073

  of die-attach connectors · CPC title