Underfill device and method

Patent metadata

Field	Value
Publication number	US-9516752-B2
Application number	US-201313846218-A
Country	US
Kind code	B2
Filing date	Mar 18, 2013
Priority date	Jun 29, 2005
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

First claim

What is claimed is:

1. An underfill, comprising:
a single material compliant polymer underfill film including a first surface and a second surface, wherein the underfill film includes a eradiated microstructure;
a first adhesive coupled the first surface and a second adhesive coupled to the second surface;
a first peel off layer coupled to the first adhesive and a second peel off layer coupled to the second adhesive; and
at least one conductive through thickness plug attached to and passing through the single material compliant polymer underfill film.

2. The underfill of claim 1 , wherein the at least one conductive through thickness plug includes solder.

3. The underfill of claim 2 , wherein the at least one conductive through thickness plug includes a metal coating between a portion of the polymer and the solder.

4. The underfill of claim 1 , wherein the at least one conductive through thickness plug includes conductive epoxy.

5. The underfill of claim 1 , wherein the first adhesive and the second adhesive are a thermally activated adhesive layer coupled to the single material compliant polymer underfill film.

6. An underfill assembly, comprising:
a stand-alone underfill film, wherein mechanical properties of the underfill film are gradiated between a top surface of the film and a bottom surface of the film and the underfill film is a single composition material with a gradiated microstructure between the top surface of the film and the bottom surface of the film;
a first adhesive coupled the top surface and a second adhesive coupled to the bottom surface;
a first peel off layer coupled to the first adhesive and a second peel off layer coupled to the second adhesive; and
at least one conductive through thickness plug attached to the underfill film.

7. The underfill assembly of claim 6 , wherein the underfill film includes a polymer film.

8. The underfill assembly of claim 6 , wherein the conductive through thickness plug includes a metal coating between the underfill film and an amount of solder.

9. An information handling system, comprising:
a processor assembly to electrically communicate with a circuit board through at least one input/output connection;
a wireless communication circuit coupled to the processor assembly;
an underfill layer located between at least a portion of the processor assembly and the circuit board, including:
a single material compliant polymer underfill film including a first surface and a second surface, wherein the underfill film includes a gradiated microstructure;
a first adhesive coupled the first surface and a second adhesive coupled to the second surface;
a first peel off layer coupled to the first adhesive and a second peel off layer coupled to the second adhesive; and
at least one conductive through thickness plug attached to and passing through the single material compliant polymer underfill film.

10. The information handling system of claim 9 , wherein the adhesive layer is located between the compliant polymer film and the processor assembly.

11. The information handling system of claim 9 , wherein the input/output connection includes a reflowed solder connection.

12. The information handling system of claim 9 , wherein the wireless communication circuit includes a mobile telephone communication circuit.

Assignees

• Intel Corp

Inventors

• Brusso Patricia A
• Modi Mitul B
• Mccormick Carolyn R
• Cadena Ruben
• Subramanian Sankara J
• Martin Edward L

Classifications

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• G06F1/16

  Constructional details or arrangements · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title