Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
Apparatus for reducing the effect of contamination on a rapid thermal process
US9514969B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9514969-B2 |
| Application number | US-201414550781-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2014 |
| Priority date | Nov 26, 2013 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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Abstract
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Embodiments of the present disclosure provide a cover assembly that includes a cover disposed between a device side surface of a substrate and a reflector plate, which are disposed within a thermal processing chamber. The presence of the cover between the device side surface of a substrate and a reflector plate has many advantages over conventional thermal processing chamber designs, which include an improved temperature uniformity during processing, a reduced chamber down time and an improved cost-of-ownership of the processes performed in the thermal processing chamber. In some configurations, the cover includes two or more ports that are formed therein and are positioned to deliver a gas, from a space formed between the reflector plate and the cover, to desired regions of the substrate during processing to reduce the temperature variation across the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermal processing chamber, comprising: an energy source positioned to deliver energy towards a substrate support during processing; a reflector having a reflective surface, wherein the substrate support is disposed between the energy source and the reflector; a cover disposed between the reflector and the substrate support, wherein a cover volume region is formed between the cover and the reflective surface and the cover is at least partially opticall…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0436Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9514969B2 cover?
- Embodiments of the present disclosure provide a cover assembly that includes a cover disposed between a device side surface of a substrate and a reflector plate, which are disposed within a thermal processing chamber. The presence of the cover between the device side surface of a substrate and a reflector plate has many advantages over conventional thermal processing chamber designs, which incl…
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).