Control of ion angular distribution of ion beams with hidden deflection electrode

Patent metadata

Field	Value
Publication number	US-9514912-B2
Application number	US-201414523428-A
Country	US
Kind code	B2
Filing date	Oct 24, 2014
Priority date	Sep 10, 2014
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A processing apparatus may include: an extraction plate disposed along a side of a plasma chamber, the extraction plate having a first and second aperture, and middle portion between the first and second aperture, the first and second aperture being configured to define a first and second ion beam when the plasma is present in the plasma chamber and an extraction voltage is applied between the extraction plate and a substrate; a hidden deflection electrode disposed adjacent the middle portion outside of the plasma chamber, and electrically isolated from the extraction plate; and a hidden deflection electrode power supply to apply a bias voltage to the hidden deflection electrode, wherein the bias voltage is configured to modify a mean angle of incidence of ions and/or a range of angles of incidence centered around the mean angle of incidence in the first and second ion beam.

First claim

What is claimed is:

1. A plasma processing apparatus comprising:
an extraction plate disposed along a side of a plasma chamber, the extraction plate having a first aperture and a second aperture, and a middle portion between the first aperture and second aperture, the first aperture and second aperture being configured to define a first ion beam and second ion beam when the plasma is present in the plasma chamber and an extraction voltage is applied between the extraction plate and a substrate;
a hidden deflection electrode disposed adjacent to the middle portion outside of the plasma chamber, and electrically isolated from the extraction plate; and
a hidden deflection electrode power supply to apply a bias voltage to the hidden deflection electrode, wherein the bias voltage is configured to modify at least one of a mean angle of incidence of ions in the first ion beam in a first direction and in the second ion beam in a second direction different from said first direction and a range of angles of incidence centered around the mean angle of incidence in the first ion beam and the second ion beam.

2. The processing apparatus of claim 1 , wherein the extraction plate forms a first plasma meniscus and a second plasma meniscus from which the first ion beam and second ion beam are formed, respectively.

3. The processing apparatus of claim 1 , wherein the extraction plate further includes a first outer portion of the extraction plate outside the first aperture, a second outer portion of extraction plate outside of second aperture and coplanar with the first outer portion, wherein the middle portion is non-coplanar with the first outer portion and second outer portion.

4. The processing apparatus of claim 1 , further comprising a hidden focusing electrode disposed adjacent to the hidden deflection electrode outside of the plasma chamber, and electrically isolated from the extraction plate and the hidden deflection electrode.

5. The processing apparatus of claim 4 , wherein the hidden focusing electrode includes a third aperture disposed adjacent to the middle portion, wherein the third aperture is configured to allow the first ion beam and the second ion beam to pass therethrough.

6. The processing apparatus of claim 5 , further comprising a second hidden deflection electrode power supply to apply a second bias voltage to the hidden focusing electrode.

7. The processing apparatus of claim 6 , wherein the second bias voltage applied to the hidden focusing electrode is configured to adjust one or more of the range of angles of incidence and the mean angle of incidence of the first ion beam and the second ion beam.

8. The processing apparatus of claim 7 , wherein the hidden deflection electrode and the hidden focusing electrode each configured to move in a direction perpendicular to the middle portion of the extraction plate.

9. The processing apparatus of claim 7 , wherein the hidden deflection electrode and the hidden focusing electrode are interoperative to adjust the range of angles of incidence and the mean angle of incidence independently of one another.

10. The processing apparatus of claim 1 , wherein the hidden deflection electrode is a first hidden deflection electrode, the extraction plate includes a third aperture and a fourth aperture and a second middle portion arranged between the third aperture and fourth aperture, the third aperture and fourth aperture being configured to define a third ion beam and fourth ion beam when the plasma is present in the plasma chamber and an extraction voltage is applied between the extraction plate and a substrate, the processing apparatus further comprising:
a second hidden deflection electrode disposed adjacent the second middle portion outside of the plasma chamber, and electrically isolated from the extraction plate; and
a second hidden deflection electrode power supply to apply a second bias voltage to the second hidden deflection electrode independently of the bias voltage applied to the first hidden deflection electrode.

11. The processing apparatus of claim 10 , further comprising:
a multi-aperture hidden focusing electrode concealed from the plasma chamber, and electrically isolated from the extraction plate and the first hidden deflection electrode and the second hidden deflection electrode, the multi-aperture hidden focusing electrode having a first focusing electrode aperture adjacent the first hidden deflection electrode and a second focusing electrode aperture adjacent the second hidden deflection electrode, and
a hidden focusing electrode voltage supply to apply a focusing voltage to the multi-aperture hidden focusing electrode independent of voltage applied to the first hidden deflection electrode and second hidden deflection electrode.

12. A plasma processing system comprising:
a plasma source coupled to a plasma chamber to generate a plasma in the plasma chamber;
an extraction plate disposed along a side of the plasma chamber, the extraction plate having a first aperture and a second aperture, and a middle portion between the first aperture and second aperture and configured to define a first ion beam and second ion beam when the plasma is present in the plasma chamber and an extraction voltage is applied between the extraction plate and a substrate;
a hidden deflection electrode disposed adjacent to the middle portion outside of the plasma chamber, and electrically isolated from the extraction plate; and
a hidden deflection electrode power supply to apply a bias voltage to the hidden deflection electrode, wherein the bias voltage is configured to modify at least one of a mean angle of incidence of ions in the first ion beam in a first direction and in the second ion beam in a second direction different from said first direction and a range of angles of incidence centered around the mean angle of incidence in the first ion beam and the second ion beam.

13. The processing system of claim 12 , wherein the extraction plate further includes a first outer portion of the extraction plate outside the first aperture, a second outer portion of extraction plate outside of second aperture and coplanar with the first outer portion, wherein the middle portion extends into the plasma chamber away from the first outer portion and the second outer portion, and the middle portion is non-coplanar with the first outer portion and second outer portion is non-coplanar with the first outer portion and second outer portion.

14. The processing system of claim 13 , wherein the extraction plate forms a first plasma meniscus between the middle portion and the first outer portion and a second plasma meniscus between the middle portion and the second outer portion from which the first ion beam and the second ion beam are formed, respectively, wherein the first plasma meniscus and the second plasma meniscus are symmetrically oriented at a predetermined angle.

15. The processing system of claim 12 , further comprising a hidden focusing electrode disposed adjacent to the hidden deflection electrode outside of the plasma chamber, and electrically isolated from the extraction plate and the hidden deflection electrode, wherein the hidden focusing electrode includes a third aperture disposed adjacent to the hidden deflection electrode, wherein the third aperture is configured to allow the first ion beam and the second ion beam to pass through, wherein the hidden deflection electrode and the hidden focusing electrode each configured to independently move in a direction perpendicular to the middle portion of the extraction plate.

16. The processing system of claim 15 , further compris

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Biloiu Costel
• Kurunczi Peter F
• Rockwell Tyler
• Campbell Christopher
• Singh Vikram
• Radovanov Svetlana

Classifications

• H01J37/32357 Primary

  Generation remote from the workpiece, e.g. down-stream · CPC title

• H01J37/08 Primary

  Ion sources; Ion guns · CPC title

• H01J2237/061

  Construction · CPC title

• H01J37/3171

  for ion implantation · CPC title

• H01J27/024

  Extraction optics, e.g. grids · CPC title