Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device

Patent metadata

Field	Value
Publication number	US-9513547-B2
Application number	US-201514607146-A
Country	US
Kind code	B2
Filing date	Jan 28, 2015
Priority date	Sep 28, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

The pattern forming method of the present invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin (A) which has a repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid and a repeating unit including a carboxyl group, a compound (B) which generates an acid according to irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam; and (iii) forming a negative tone pattern by developing the exposed film using a developer which includes an organic solvent.

First claim

What is claimed is:

1. A pattern forming method comprising:
(i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains
a resin (A) which has
a repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid,
a repeating unit including a carboxyl group,
a non-acid-decomposable repeating unit which is represented by the following general formula (1), which is different from the repeating unit including a carboxyl group,
a non-acid-decomposable repeating unit which is represented by the following general formula (1′), which is different from the repeating unit including a carboxyl group, and a repeating unit including a lactone structure, and the content of the repeating unit including the lactone structure is greater than 0 mol % and less than or equal to 10 mol % with respect to all the repeating units in the resin (A),
a compound (B) which generates an acid according to irradiation with actinic rays or radiation, and
a solvent (C);
(ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam; and
(iii) forming a negative tone pattern by developing the exposed film using a developer which includes an organic solvent;

in the general formula (1),
R represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or an alkoxycarbonyl group,
L represents a single bond or an (n+1) valent linking group,
Y represents an aromatic group, and
n represents an integer of 1 or more,

in the general formula (1′),
R′ represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or an alkoxycarbonyl group,
L′ represents a single bond or an (n′+1) valent linking group,
Y′ represents an alicyclic group, and
n′ represents an integer of 1 or more.

2. The pattern forming method according to claim 1 , wherein the exposing in (ii) is exposing using the KrF excimer laser.

3. The pattern forming method according to claim 1 , wherein in the general formula (1), L represents a single bond, an alkylene group, an aromatic ring group, a cycloalkylene group, —COO-L 1 ′-, —O-L 1 ′-, —CONH—, or a group which is formed by combining two or more of these, L 1 ′ represents an alkylene group, a cycloalkylene group, an aromatic ring group, or a group formed by combining an alkylene group and an aromatic ring group.

4. The pattern forming method according to claim 1 , wherein the resin (A) comprises a repeating unit which is represented by the following general formula (AI) as the repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid:

in the general formula (AI),
Xa 1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom,
T represents a single bond or a divalent linking group,
Rx 1 to Rx 3 each independently represents an alkyl group or a cycloalkyl group, and
two among Rx 1 to Rx 3 may be bonded to form a ring structure.

5. The pattern forming method according to claim 4 , wherein R X1 to R X3 in the general formula (AI) represent an alkyl group.

6. The pattern forming method according to claim 4 , wherein R X1 to R X3 in the general formula (AI) represent a methyl group.

7. The pattern forming method according to claim 1 , wherein the repeating unit which is represented by the general formula (1) is a repeating unit which is represented by the following general formula (1-1):

in the general formula (1-1),
R 1 represents a hydrogen atom, an alkyl group, a halogen atom, or an alkoxycarbonyl group,
X″ represents a single bond, an alkylene group, —COO—, or —CONR 64 —,
R 64 represents a hydrogen atom or an alkyl group,
L″ represents a single bond, —COO—, or an alkylene group,
Ar represents an (n″+1) valent aromatic ring group, and
n″ represents an integer of 1 to 4.

8. A method for manufacturing an electronic device which includes the pattern forming method according to claim 1 .

9. The pattern forming method according to claim 1 , wherein in the general formula (1′), L′ represents a single bond, an alkylene group, an aromatic ring group, a cycloalkylene group, —COO-L 1 ′-, —O-L 1 ′-, —CONH—, or a group which is formed by combining two or more of these, L 1 ′ represents an alkylene group, a cycloalkylene group, an aromatic ring group, or a group formed by combining an alkylene group and an aromatic ring group.

10. An actinic ray-sensitive or radiation-sensitive resin composition which is subjected to a pattern forming method comprising
(i) forming a film using the actinic ray-sensitive or radiation-sensitive resin composition,
(ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam, and
(iii) forming a negative tone pattern by developing the exposed film using a developer which includes an organic solvent,
the actinic ray-sensitive or radiation-sensitive resin composition comprising:
a resin (A) which has a repeating unit including
a group capable of generating a polar group by being decomposed due to an action of an acid,
a repeating unit including a carboxyl group, and a repeating unit including a lactone structure, and the content of the repeating unit including the lactone structure is greater than 0 mol % and less than or equal to 10 mol % with respect to all the repeating units in the resin (A);
a non-acid-decomposable repeating unit which is represented by the following general formula (1), which is different from the repeating unit including a carboxyl group,
a non-acid-decomposable repeating unit which is represented by the following general formula (1′), which is different from the repeating unit including a carboxyl group;
a compound (B) which generates an acid according to irradiation with actinic rays or radiation; and
a solvent (C),

in the general formula (1),
R represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or an alkoxycarbonyl group,
L represents a single bond or an (n+1) valent linking group,
Y represents an aromatic group, and
n represents an integer of 1 or more,

in the general formula (1′),
R′ represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or an alkoxycarbonyl group,
L′ represents a single bond or an (n′+1) valent linking group,
Y′ represents an alicyclic group, and
n′ represents an integer of 1 or more.

11. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 10 ,
wherein in the general formula (1),
L represents a single bond, an alkylene group, an aromatic ring group, a cycloalkylene group, —COO-L 1 ′-, —O-L 1 ′-, —CONH—, or a group which is formed by combining two or more of these,
L 1 ′ represents an alkylene group, a cycloalkylene group, an aromatic ring group, or a group formed

Assignees

• Fujifilm Corp

Inventors

• Kamimura Sou
• Takahashi Hidenori
• Kato Keita

Classifications

• C08F220/26

  Esters containing oxygen in addition to the carboxy oxygen · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• C08F212/32

  containing two or more rings · CPC title

• C08F220/04

  Acids; Metal salts or ammonium salts thereof · CPC title