Methods for determining mechanical quantities associated with a deformation force by utilizing an integrated computational element

US9513110B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9513110-B2
Application numberUS-201414403223-A
CountryUS
Kind codeB2
Filing dateJan 31, 2014
Priority dateJan 31, 2014
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Mechanical quantities associated with a deformation force impacting a structure may be determined using one or more integrated computational elements. Methods for determining a mechanical quantity may comprise: optically interacting electromagnetic radiation with one or more integrated computational elements and a target area of a structure, the structure comprising a deformable material in an initial amount and a reference material in an initial amount within the target area; exposing the structure to a deformation force; determining a change in amount of the deformable material or the reference material within the target area, using the one or more integrated computational elements; and correlating the change in amount of the deformable material or the reference material within the target area to a mechanical quantity associated with the deformation force.

First claim

Opening claim text (preview).

What is claimed is the following: 1. A method comprising: optically interacting electromagnetic radiation with one or more integrated computational elements and a target area of a structure, the structure comprising a deformable material in an initial amount and a reference material in an initial amount within the target area; exposing the structure to a deformation force; determining a change in amount of the deformable material or the reference material within the target area, using the one or more integrated computational elements; and correlating the change in amount of the deformable material or the reference material within the target area to a mechanical quantity associated with the deformation force. 2. The method of claim 1 , wherein the mechanical quantity comprises a condition selected from the group consisting of strain, stress, thermal expansion, thermal contraction, pressure, and any combination thereof. 3. The method of claim 1 , wherein exposing the structure to a deformation force comprises applying a load to the structure or applying pressure to the structure. 4. The method of claim 1 , wherein the deformable material comprises an elastically deformable material. 5. The method of claim 1 , wherein the deformable material comprises an inelastically deformable material. 6. The method of claim 1 , wherein the reference material is substantially non-deformable when exposed to the deformation force. 7. The method of claim 1 , wherein the reference material is present only on a surface of the structure. 8. The method of claim 7 , wherein the reference material is present only within the target area of the structure. 9. The method of claim 7 , wherein the reference material comprises a thin film coating on a surface of the structure. 10. The method of claim 1 , wherein a change in amount of the deformable material, the reference material, or both the deformable material and the reference material is determined, and the change in amount of either or both materials is correlated to the mechanical quantity. 11. The method of claim 1 , wherein the one or more integrated computational elements are configured to be movable relative to the structure, such that electromagnetic radiation is received from multiple target areas of the structure by the one or more integrated computational elements. 12. The method of claim 1 , wherein the one or more integrated computational elements are arranged in a fixed array, such that electromagnetic radiation is received from multiple target areas of the structure by one or more integrated computational elements located proximate to each target area. 13. The method of claim 1 , wherein the deformable material and the reference material are arranged in alternating layers within the target area. 14. The method of claim 1 , wherein the reference material comprises particulates that are distributed in the deformable material. 15. The method of claim 1 , wherein the change in amount of the deformable material or the reference material within the target area is determined while the structure is being exposed to the deformation force. 16. The method of claim 1 , further comprising: detecting the electromagnetic radiation that has optically interacted with the target area and the one or more integrated computational elements; and generating an output signal based on the detected electromagnetic radiation, the output signal being correlatable to the change in amount of the deformable material or the reference material within the target area. 17. A method comprising: optically interacting electromagnetic radiation with one or more integrated computational elements and a target area of a structure, the structure comprising a deformable material and a reference material within the target area; determining an initial amount of the deformable material or the reference material within the target area, using the one or more integrated computational elements; after determining the initial amount of the deformable material or the reference material within the target area, allowing the structure to undergo deformation in the presence of a deformation force; after allowing the structure to undergo deformation, determining an amount of the deformable material or the reference material within the target area, using the one or more integrated computational elements; and correlating a change in amount of the deformable material or the reference material within the target area to a mechanical quantity associated with the deformation force. 18. The method of claim 17 , wherein the mechanical quantity comprises a condition selected from the group consisting of strain, stress, thermal expansion, thermal contraction, pressure, and any combination thereof. 19. The method of claim 17 , wherein the reference material is present only on a surface of the structure. 20. The method of claim 17 , wherein a change in amount of the deformable material, the reference material, or both the deformable material and the reference material is determined, and the change in amount of either or both materials is correlated to the mechanical quantity. 21. The method of claim 17 , wherein the deformable material and the reference material are arranged in alternating layers. 22. The method of claim 17 , wherein the reference material comprises particulates that are distributed in the deformable material. 23. A sensor comprising: a structure comprising a deformable material and a reference material within a target area; one or more integrated computational elements located proximate to the target area; and a detector configured to receive electromagnetic radiation that has optically interacted with the target area and the one or more integrated computational elements.

Assignees

Inventors

Classifications

  • G01B11/16Primary

    for measuring the deformation in a solid, e.g. optical strain gauge · CPC title

  • using wave or particle radiation, e.g. X-rays {, microwaves}, neutrons (G01L1/24 takes precedence) · CPC title

  • by photoelastic stress analysis · CPC title

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What does patent US9513110B2 cover?
Mechanical quantities associated with a deformation force impacting a structure may be determined using one or more integrated computational elements. Methods for determining a mechanical quantity may comprise: optically interacting electromagnetic radiation with one or more integrated computational elements and a target area of a structure, the structure comprising a deformable material in an …
Who is the assignee on this patent?
Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification G01B11/16. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).