Tunable voltage margin access diodes

Patent metadata

Field	Value
Publication number	US-9508930-B2
Application number	US-201615132675-A
Country	US
Kind code	B2
Filing date	Apr 19, 2016
Priority date	Mar 23, 2015
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

The present invention relates generally to high current density access devices (ADs), and more particularly, to a structure and method of forming tunable voltage margin access diodes in phase change memory (PCM) blocks using layers of copper-containing mixed ionic-electronic conduction (MIEC) materials. Embodiments of the present invention may use layers MIEC material to form an access device that can supply high current-densities and operate reliably while being fabricated at temperatures that are compatible with standard BEOL processing. By varying the deposition technique and amount of MIEC material used, the voltage margin (i.e. the voltage at which the device turns on and the current is above the noise floor) of the access device may be tuned to specific operating conditions of different memory devices.

First claim

What is claimed is:

1. A method comprising:
forming a mixed ionic-electronic conduction (MIEC) layer directly on a carbon doped silicon germanium substrate, the MIEC layer comprising three individual layers of molybdenum disulfide stacked one on top of another, wherein each layer of molybdenum disulfide comprises two hexagonal planes of sulfur atoms separated by one hexagonal plane of molybdenum atoms;
doping the MIEC layer with interstitial chromium atoms using an ion implantation technique to achieve a concentration of approximately 8%;
patterning the doped MIEC layer into multiple ribbons each having an approximate width of 1 nm;
forming a first titanium electrode at a first end of the ribbons, a bottom surface of the first titanium electrode is in direct contact with a top surface of the MIEC layer; and
forming a second titanium electrode at a second end of the ribbons such that current flows horizontally from the first titanium electrode to the second titanium electrode and through the MIEC layer, a bottom surface of the second titanium electrode is in direct contact with a top surface of the MIEC layer.

Assignees

• IBM

Inventors

• Bajaj Mohit
• Deb Arpan K
• Konar Aniruddha
• Murali Kota V R M
• Pandey Rajan K
• Virwani Kumar R

Classifications

• H10P14/3436

  being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

• H10P14/24

  using chemical vapour deposition [CVD] · CPC title

• Y10S977/943

  Information storage or retrieval using nanostructure · CPC title

• Y10S977/76

  Superlattice with graded effective bandgap, e.g. "chirp-graded" superlattice · CPC title

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title