Method for manufacturing a silicon carbide semiconductor element
US-2015380248-A1 · Dec 31, 2015 · US
Method for lower thermal budget multiple cures in semiconductor packaging
US9508616B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9508616-B2 |
| Application number | US-201213506722-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 11, 2012 |
| Priority date | May 11, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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- Title
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Abstract
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A method for forming a multilayer structure comprises the steps of: depositing a first polymerizable layer on a substrate; applying microwave energy to the polymerizable layer while monitoring at least one property of the layer; and, ending the application of microwave energy when the monitored property indicates that the polymerizable layer has reached a desired degree of cure. The property monitored may be optical, e.g., Raman spectrum, or electrical, e.g., dielectric loss. This process control strategy lowers the overall thermal budget, and is especially suitable for curing polymer films on silicon. The method may be used repetitively to cure multiple layers of polymeric material when a thicker film is needed.
First claim
Opening claim text (preview).
We claim: 1. A method for forming a multilayer structure, comprising depositing a first uncured polymerizable layer on a substrate; applying microwave energy to said first uncured polymerizable layer while monitoring in situ at least one property of said first uncured polymerizable layer; ending said application of microwave energy when said monitored property indicates that said first uncured polymerizable layer is cured to a desired degree of cure to make a first cured layer…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9508616B2 cover?
- A method for forming a multilayer structure comprises the steps of: depositing a first polymerizable layer on a substrate; applying microwave energy to the polymerizable layer while monitoring at least one property of the layer; and, ending the application of microwave energy when the monitored property indicates that the polymerizable layer has reached a desired degree of cure. The property mo…
- Who is the assignee on this patent?
- Ahmad Iftikhar, Hubbard Robert L, Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P74/238. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).