Potting method for lamp chain

Patent metadata

Field	Value
Publication number	US-9508506-B2
Application number	US-201113976066-A
Country	US
Kind code	B2
Filing date	Dec 13, 2011
Priority date	Dec 30, 2010
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.

First claim

The invention claimed is:

1. A potting method for a lamp chain, the method comprising:
a) providing a mold having a potting groove;
b) providing a fixing support which is fixedly kept in the potting groove;
c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixing support;
d) potting a potting material into the potting groove and curing the potting material; and
e) removing the mold,
wherein, in a), the potting groove having a U-shape section contour is provided; and in b) the fixing support consisting of multiple U-shape supports spaced apart is provided,
wherein, in b), the height of the multiple U-shape supports is made to be less than or equal to the depth of the potting groove.

2. The potting method according to claim 1 , wherein, in b), the fixing support made of a flexible material is provided.

3. The potting material according to claim 2 , wherein, in b), the fixing support made of a material the same as the potting material is provided.

4. The potting method according to claim 1 , wherein, in b), the fixing support is clamped in the potting groove.

5. The potting method according to claim 1 , wherein, in c), the printed circuit board is clamped in the fixing support.

6. A potting method for a lamp chain, the method comprising:
a) providing a mold having a potting groove;
b) providing a fixing support which is fixedly kept in the potting groove;
c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixing support;
d) potting a potting material into the potting groove and curing the potting material; and
e) removing the mold,
wherein, in a), the potting groove having a U-shape section contour is provided; and in b) the fixing support consisting of multiple U-shape supports spaced apart is provided,
wherein, in c), the depth of the opening of the U-shape support is made to be greater than the thickness of the printed circuit board.

7. The potting method according to claim 1 , wherein the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.

8. The potting method according to claim 6 , wherein, in b), the fixing support made of a flexible material is provided.

9. The potting material according to claim 7 , wherein, in b), the fixing support made of a material the same as the potting material is provided.

10. The potting method according to claim 6 , wherein, in b), the fixing support is clamped in the potting groove.

11. The potting method according to claim 6 , wherein, in c), the printed circuit board is clamped in the fixing support.

12. The potting method according to claim 6 , wherein the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.

Assignees

• Fan Huajian
• Li Shuai
• Wu Hui
• Ye Zesheng
• Osram Gmbh

Inventors

• Fan Huajian
• Li Shuai
• Wu Hui
• Ye Zesheng

Classifications

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• F21S4/10

  with light sources attached to loose electric cables, e.g. Christmas tree lights · CPC title

• H05K2203/1322

  Encapsulation comprising more than one layer · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• B29C41/20 Primary

  incorporating preformed parts or layers, e.g. moulding inserts or for coating articles · CPC title