Optical modules

Patent metadata

Field	Value
Publication number	US-9507109-B2
Application number	US-201614987808-A
Country	US
Kind code	B2
Filing date	Jan 5, 2016
Priority date	Nov 19, 2010
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

First claim

What is claimed is:

1. An optical module comprising:
an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth;
a lens in the first trench of the optical bench;
at least one semiconductor chip in the second trench of the optical bench;
a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches; and
a metal package component surrounding the optical bench having the lens and the semiconductor chip and the flexible printed circuit board to protect them from an external environment,
wherein the optical bench is a metal optical bench or a silicon optical bench,
wherein a ceramic feed-through is provided in the metal package component;
the ceramic feed-through is electrically connected to an external flexible printed circuit board outside the metal package component; and
the flexible printed circuit board is electrically connected to the ceramic feed-through inside the metal package component.

2. The optical module of claim 1 , wherein
the flexible printed circuit board is electrically connected to the ceramic feed-through through a ribbon wire or a bonding wire; and
the external flexible printed circuit board is electrically connected to the ceramic feed-through through soldering.

3. The optical module of claim 1 , wherein the metal package component comprises a receptacle for connecting to an external ferrule, with a window adjacent to the lens.

4. The optical module of claim 1 , further comprising a matching resistor on the flexible printed circuit board.

5. The optical module of claim 1 , wherein the semiconductor chip comprises at least one of an electro-absorption modulated laser, a capacitor, a photodiode, a laser diode, or a thermistor.

6. The optical module of claim 1 , wherein the flexible printed circuit board comprises:
a conductive line;
a lower ground line; and
an insulation layer between the conductive line and the lower ground line,
wherein the conductive line comprises a signal transmission line, an upper ground line, and an electrode line.

7. The optical module of claim 6 , wherein
the flexible printed circuit board has via holes for electrically connecting the upper ground line with the lower ground line; and
the upper ground line and the lower ground line are electrically connected to each other through a conductive material filling at least a portion of the via holes.

8. The optical module of claim 6 , wherein the lower ground line of the flexible printed circuit board is electrically connected to the optical bench.

9. The optical module of claim 6 , wherein the signal transmission line and the upper ground line are a coplanar waveguide or a microstrip line.

10. The optical module of claim 1 , wherein the metal optical bench comprises one of copper-tungsten, copper, kovar, an aluminum alloy, or a combination thereof.

11. The optical module of claim 1 , wherein the silicon optical bench comprises:
a silicon substrate; and
a gold plating layer on the silicon substrate.

12. The optical module of claim 1 , wherein the lens is a lens fixed with a metal housing or a lens of a bare chip shape.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Han Young-Tak
• Shin Jang Uk
• Han Sang-Pil
• Park Sang Ho
• Baek Yongsoon

Classifications

• G02B6/325

  comprising a transparent member, e.g. window, protective plate · CPC title

• G02B6/4279 Primary

  Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations · CPC title

• G02B6/4257

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• G02B2006/12092

  Stepped · CPC title

• G02B6/4201

  Packages, e.g. shape, construction, internal or external details · CPC title