Substrate processing apparatus
US-2024021419-A1 · Jan 18, 2024 · US
US9506145B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9506145-B2 |
| Application number | US-201615180514-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 13, 2016 |
| Priority date | Aug 23, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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A cleaning method for a UV chamber involves providing a first cleaning gas, a second cleaning gas, and a purge gas to one or more openings in the chamber. The first cleaning gas may be an oxygen containing gas, such as ozone, to remove carbon residues. The second cleaning gas may be a remote plasma of NF 3 and O 2 to remove silicon residues. The UV chamber may have two UV transparent showerheads, which together with a UV window in the chamber lid, define a gas volume proximate the UV window and a distribution volume below the gas volume. A purge gas may be flowed through the gas volume while one or more of the cleaning gases is flowed into the distribution volume to prevent the cleaning gases from impinging on the UV transparent window.
Opening claim text (preview).
The invention claimed is: 1. A method of cleaning a process chamber having an interior space, comprising: providing a purge gas to a first portion of the interior space; providing a first cleaning gas to a second portion of the interior space, wherein the first portion of the interior space is separated from the second portion of the interior space by a first UV transparent showerhead; activating the first cleaning gas using ultraviolet (UV) radiation from UV lamps positioned…
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
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