Substrate processing apparatus
US-2024021419-A1 · Jan 18, 2024 · US
Elimination of first wafer effect for PECVD films
US9157151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9157151-B2 |
| Application number | US-75635807-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2007 |
| Priority date | Jun 5, 2006 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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Abstract
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The present invention generally provides an apparatus and method for eliminating the “first wafer effect” for plasma enhanced chemical vapor deposition (PECVD). One embodiment of the present invention provides a method for preparing a chamber after the chamber being idle for a period of time. The method comprises a cleaning step followed by a season step and a heating step adapted to the length of the idle time.
First claim
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The invention claimed is: 1. A method for preparing a chamber after the chamber being idle for a period of time, comprising: prior to introducing a substrate into the chamber, seasoning a liquid flow meter by flowing a liquid precursor through the liquid flow meter with radio frequency power turned off for a given period of time; cleaning the chamber using a first active species; seasoning the chamber by delivering a first gas mixture while applying radio frequency power to th…
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Chemistry & Metallurgy · mapped topic
- C23C16/4405Primary
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9157151B2 cover?
- The present invention generally provides an apparatus and method for eliminating the “first wafer effect” for plasma enhanced chemical vapor deposition (PECVD). One embodiment of the present invention provides a method for preparing a chamber after the chamber being idle for a period of time. The method comprises a cleaning step followed by a season step and a heating step adapted to the length…
- Who is the assignee on this patent?
- Lakshmanan Annamalai, Balasubramanian Ganesh, Schmitt Francimar, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification C23C16/4405. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Oct 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).