Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
No flow underfill or wafer level underfill and solder columns
US8963340B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963340-B2 |
| Application number | US-201113231594-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2011 |
| Priority date | Sep 13, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
Official abstract text for this publication.
A preassembly semiconductor device comprises substrate soldering structures extending toward chip soldering structures for forming solder connections with the chip soldering structures, i.e., the chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the semiconductor chip and the substrate to one another.
First claim
Opening claim text (preview).
We claim: 1. A preassembly semiconductor device comprising; a) a semiconductor chip comprising chip soldering structures C4 connectors; b) a substrate comprising substrate soldering structures that correspond to and extend toward said chip soldering structures for forming solder connections with said chip soldering structures, the height of said substrate soldering structures being greater than the height of said chip soldering structures; c) said chip and said substrate being…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8963340B2 cover?
- A preassembly semiconductor device comprises substrate soldering structures extending toward chip soldering structures for forming solder connections with the chip soldering structures, i.e., the chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied …
- Who is the assignee on this patent?
- Feger Claudius, Gaynes Michael A, Nah Jae-Woong, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/012. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).