Printed wiring board and method for manufacturing printed wiring board
US-2015366061-A1 · Dec 17, 2015 · US
Hybrid circuit assembly
US9504157B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9504157-B2 |
| Application number | US-201314016806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 3, 2013 |
| Priority date | Sep 3, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
First claim
Opening claim text (preview).
What is claimed is: 1. A hybrid circuit assembly, comprising: an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon, the IMS including a metal base plate, an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive, the metal base plate including a recess formed in an upper surface thereof; and a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon, the multi-layer PWB connected to the IMS and having an upper surface that is co-planar with an upper surface of the IMS, the PWB mounted on the metal base plate and within the recess via the insulating adhesive. 2. The hybrid circuit assembly of claim 1 , wherein the low voltage, low-power components of the PWB are electrically connected to the high voltage, high-power components of the IMS. 3. The hybrid circuit assembly of claim 1 , wherein the IMS adjoins the multi-layer PWB on at least two sides. 4. The hybrid circuit assembly of claim 1 , wherein the multi-layer PWB is connected to the IMS with at least one of an adhesive and a fixing structure. 5. The hybrid circuit assembly of claim 1 , wherein a thickness of conductive traces on the IMS is greater than a thickness of traces on the PWB.
Assignees
Inventors
Classifications
Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · CPC title
electrically connecting electric components or wires to printed circuits · CPC title
- H05K1/142Primary
Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title
Assembling bases · CPC title
Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title
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Frequently asked questions
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- What does patent US9504157B2 cover?
- A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mount…
- Who is the assignee on this patent?
- Raytheon Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/142. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).