Elastic flexible substrate and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9504139-B2
Application number	US-201514626881-A
Country	US
Kind code	B2
Filing date	Feb 19, 2015
Priority date	Mar 31, 2014
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

There is provided an elastic flexible substrate including an insulating film base material which includes a wire. The insulating film base material includes an opening which is formed by opening a slit, and an opened state of the opening is held by an insulating member.

First claim

What is claimed is:

1. An elastic flexible substrate comprising:
an insulating film base material; and
a wire provided at the insulating film base material, wherein
the insulating film base material includes an opening which is formed by opening a slit, and
an opened state of the opening is held by an insulating member.

2. The elastic flexible substrate according to claim 1 , wherein a shape of the opening is deformable in response to expansion or contraction of the insulating film base material.

3. The elastic flexible substrate according to claim 1 , wherein portions, located on both sides of the opening, of the insulating film base material are tilted in a same direction.

4. The elastic flexible substrate according to claim 1 , wherein
the opening includes two adjacent openings, and
a part of a portion, defining one opening of the two adjacent openings, of the insulating film base material and a part of a portion, defining the other opening of the two adjacent openings, of the insulating film base material are continuous.

5. The elastic flexible substrate according to claim 1 , wherein
the wire includes a first wire and a second wire,
the insulating film base material has two principal surfaces, and
the first wire which is provided on one of the two principal surfaces of the insulating film base material and the second wire which is provided on the other principal surface of the insulating film base material are electrically connected via a connection via.

6. The elastic flexible substrate according to claim 1 , wherein
the wire includes a first wire and a second wire, and
the first wire and the second wire intersect in a separated state above the insulating film base material between two adjacent openings.

7. The elastic flexible substrate according to claim 1 , wherein
the opening includes a plurality of openings, and
the plurality of openings are concentrically arranged.

8. The elastic flexible substrate according to claim 7 , wherein the insulating film base material forms a hemispherical shape as a whole.

9. The elastic flexible substrate according to claim 1 , wherein
the wire is locally exposed from the insulating member, and
an electronic element is provided on the exposed portion of the wire.

10. The elastic flexible substrate according to claim 9 , wherein the electronic element is at least one selected from a group consisting of a semiconductor device, a sensor element, and an actuator.

11. The elastic flexible substrate according to claim 1 , wherein at least one selected from a group consisting of the insulating film base material and the insulating member is transparent to visible light.

12. The elastic flexible substrate according to claim 1 , wherein the insulating member has elasticity.

13. The elastic flexible substrate according to claim 1 , wherein the insulating member is made of at least one selected from a group consisting of a silicone based resin, a chemical fiber, cotton, woven fabric, and non-woven fabric.

14. The elastic flexible substrate according to claim 1 , wherein the insulating film base material is made of at least one selected from a group consisting of polyimide resin, PET resin, PEN resin, and a liquid crystal polymer.

15. The elastic flexible substrate according to claim 1 , wherein the wire is made of at least one selected from a group consisting of copper, silver, and ITO.

16. A method for manufacturing an elastic flexible substrate, comprising:
providing a wire at an insulating film base material;
forming a slit in the insulating film base material;
opening the slit; and
holding an opened state of the slit by an insulating member.

17. The method according to claim 16 , wherein a member having elasticity is used as the insulating member.

18. The method according to claim 16 , wherein a shape of the slit is at least one selected from a group consisting of a linear shape, a shape with circles at both ends, and an oval shape.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Ogura Tetsuyoshi
• Wakuda Daisuke
• Matsumoto Takashi

Classifications

• H05K1/0281

  Reinforcement details thereof · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K1/0283

  Stretchable printed circuits · CPC title