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Flexible substrate having a microstrip line connected to a connection portion with a specified conductor pattern
US9502745B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502745-B2 |
| Application number | US-201414339033-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 23, 2014 |
| Priority date | Jul 24, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Abstract
Official abstract text for this publication.
A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.
First claim
Opening claim text (preview).
What is claimed is: 1. A flexible substrate comprising: an insulating substrate having a first surface and a second surface opposite to the first surface, the insulating substrate including resin; a first connection portion configured to be connected with an external conductor and having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor an…
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Frequently asked questions
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- What does patent US9502745B2 cover?
- A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and r…
- Who is the assignee on this patent?
- Sedi Inc
- What technology area does this patent fall under?
- Primary CPC classification H01P5/028. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).