Low-loss coplanar waveguide bonding structure and manufacturing method thereof
US-2024045160-A1 · Feb 8, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01P1/047 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 158 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 11 |
| 2017 | 8 |
| 2018 | 5 |
| 2019 | 8 |
| 2020 | 11 |
| 2021 | 15 |
| 2022 | 23 |
| 2023 | 21 |
| 2024 | 23 |
| 2025 | 19 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Components for millimeter-wave communication
US-2021407934-A1 · Dec 30, 2021 · US
Additive manufacturing technology (AMT) low profile radiator
US-11121474-B2 · Sep 14, 2021 · US
FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FROM IC TO PCB VIA CHIP-SCALE PACKAGING
US-2021082840-A1 · Mar 18, 2021 · US
High-frequency transmission line, radar apparatus provided with high-frequency transmission line, and wireless device
US-2021021010-A1 · Jan 21, 2021 · US
Interlocking modular beamformer
US-2020395651-A1 · Dec 17, 2020 · US
Millimeter wave module and method of manufacturing millimeter wave module
US-2020388897-A1 · Dec 10, 2020 · US
Radio frequency connection arrangement
US-10854942-B2 · Dec 1, 2020 · US
Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable
US-10855010-B2 · Dec 1, 2020 · US
Memory system and storage device including printed circuit board where channel groups have both point to point topology and daisy chain topology
US-10820419-B2 · Oct 27, 2020 · US
Vertical transitions for microwave and millimeter wave communications systems having multi-layer substrates
US-2020303799-A1 · Sep 24, 2020 · US
Substrate joined body and transmission line device
US-2020280117-A1 · Sep 3, 2020 · US
Antenna module
US-2020194869-A1 · Jun 18, 2020 · US
Transmission line device
US-2020194859-A1 · Jun 18, 2020 · US
Distributor and synthesizer
US-2020161737-A1 · May 21, 2020 · US
Impedance Controlled Electrical Interconnection Employing Meta-Materials
US-2020083171-A1 · Mar 12, 2020 · US
Impedance controlled electrical interconnection employing meta-materials
US-10483209-B2 · Nov 19, 2019 · US
Radio frequency interconnect systems and methods
US-10347961-B2 · Jul 9, 2019 · US
Radio frequency connection arrangement
US-2019190110-A1 · Jun 20, 2019 · US
Wide-band high speed communications channel for cryogenic applications
US-10305193-B1 · May 28, 2019 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01P1/047?
- CPC H01P1/047 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01P1/047 (Electricity)?
- Our database includes 158 publications tagged with this CPC code.
- Is patent activity under CPC H01P1/047 growing?
- Publication counts under this code: 23 in 2024 vs 19 in 2025 (latest complete years).