Method for manufacturing liquid crystal display device

Patent metadata

Field	Value
Publication number	US-9502613-B2
Application number	US-201314425303-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Sep 4, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

The present invention provides a method for manufacturing a liquid crystal display device capable of reducing thermal damage to a polarizing plate during thermo-compression bonding, thereby sufficiently preventing the occurrence of defects due to the deformation of the polarizing plate. The method for manufacturing a liquid crystal display device according to the present invention is for thermo-compression bonding a terminal portion of a liquid crystal panel and an external circuit using a pressure bonding device configured of a stage, a heat source, and a buffer member. The manufacturing method includes placing the liquid crystal panel on the stage, and thermo-compression bonding the terminal portion of the liquid crystal panel and the external circuit by heat from the heat source via the buffer member interposed between the heat source and the external circuit. The pressure bonding device has a heat shield member that shields heat from the heat source to the polarizing plate, and/or a heat dissipation portion that dissipates heat from the heat source. In the thermo-compression bonding, the heat shield member and/or the heat dissipation portion overlap with at least a part of the polarizing plate bonded to the liquid crystal panel when planarly viewing the principal surface of the panel.

First claim

What is claimed is:

1. A method of manufacturing a liquid crystal display device in which a terminal portion of a liquid crystal panel and an external circuit are bonded together by thermo-compression using a pressure bonding device comprising a stage and a heat source, the method comprising:
placing the liquid crystal panel on the stage; and
thermo-compression bonding the terminal portion of the liquid crystal panel to the external circuit with heat from the heat source using a buffer member, at least a portion of the buffer member being interposed between the heat source and the external circuit during the thermo-compressing bonding,
wherein, in the step of thermo-compression bonding, a heat shield member is used such that said heat shield member overlaps with at least a part of a polarizing plate bonded to the liquid crystal panel in a plan view, and is in direct contact with said at least part of said polarizing plate, the heat shield member shielding the polarizing plate on the liquid crystal panel from heat from the heat source.

2. The method of manufacturing a liquid crystal display device according to claim 1 , wherein a thickness of the buffer member varies by location.

3. The method of manufacturing a liquid crystal display device according to claim 2 ,
wherein, in the step of thermo-compression bonding, a part of the buffer member overlaps with the polarizing plate, said part of the buffer member includes said heat shield member, and a thickness of said part of the buffer member is greater than a thickness of a part thereof that does not overlap with the polarizing plate.

4. The method of manufacturing a liquid crystal display device according to claim 1 , wherein, in the step of thermo-compression bonding, the pressure bonding device has the heat shield member partially laminated on the stage and a pedestal attached to the stage.

5. The method of manufacturing a liquid crystal display device according to claim 1 ,
wherein a thickness of the heat shield member is greater than or equal to 30 μm.

6. The method of manufacturing a liquid crystal display device according to claim 1 , wherein a thickness of the heat shield member is uniform.

7. A method of manufacturing a liquid crystal display device in which a terminal portion of a liquid crystal panel and an external circuit are bonded together by thermo-compression using a pressure bonding device comprising a stage and a heat source, the method comprising:
placing the liquid crystal panel on the stage; and
thermo-compression bonding the terminal portion of the liquid crystal panel to the external circuit with heat from the heat source using a buffer member, at least a portion of the buffer member being interposed between the heat source and the external circuit during the thermo-compressing bonding,
wherein, in the step of thermo-compression bonding, a part of the buffer member overlaps with at least a part of a polarizing plate bonded to the liquid crystal panel in a plan view, and said part of the buffer member includes an adhesive layer and at least one of a heat shield member and a heat dissipation member, the heat shield member shielding a polarizing plate on the liquid crystal panel from heat from the heat source, the heat dissipation member dissipating heat from the heat source, and
wherein the adhesive layer in the said part of the buffer member makes direct contact with said at least part of the polarizing plate.

8. The method of manufacturing a liquid crystal display device according to claim 7 , wherein a thickness of the buffer member varies by location.

9. The method of manufacturing a liquid crystal display device according to claim 8 ,
wherein, in the step of thermo-compression bonding, a thickness of said part of the buffer member that overlaps with said at least part of the polarizing plate is greater than a thickness of a part thereof that does not overlap with said at least part of the polarizing plate.

10. The method of manufacturing a liquid crystal display device according to claim 7 , wherein the part of the buffer member that overlaps with the polarizing plate includes the heat shield member.

11. The method of manufacturing a liquid crystal display device according to claim 7 , wherein the part of the buffer member that overlaps with said at least part of the polarizing plate includes the heat shield member and the heat dissipation member that are layered together.

Assignees

• Sharp Kk

Inventors

• Sugihara Yasuhiko
• Ashida Takeyuki

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W80/334

  Thermocompression bonding · CPC title

• H10H20/0365

  of means for heat extraction or cooling · CPC title