Printhead die with multiple termination rings

Patent metadata

Field	Value
Publication number	US-9498953-B2
Application number	US-201314762958-A
Country	US
Kind code	B2
Filing date	Jan 23, 2013
Priority date	Jan 23, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.

First claim

What is claimed is:

1. A printhead die comprising:
a SiO2 layer grown into a surface of a silicon substrate;
a dielectric layer formed on the surface over an interior area of the substrate;
a first termination ring surrounding the interior area and defined by an absence of the dielectric layer;
a berm surrounding the first termination ring and defined by the presence of the dielectric layer; and
a second termination ring surrounding the berm and defined by an absence of the dielectric layer.

2. A printhead die as in claim 1 wherein the SiO2 layer covers a frame area of the substrate that surrounds the interior area and extends from the interior area to edges of the substrate, such that the SiO2 layer underlies the termination rings and the berm.

3. A printhead die as in claim 2 wherein the SiO2 layer has been removed from under the termination rings.

4. A printhead die as in claim 2 wherein the SiO2 layer has been removed from under the berm.

5. A printhead die as in claim 2 wherein the SiO2 layer covers part of the frame area such that the SiO2 layer underlies the termination rings but does not underlie the berm.

6. A printhead die as in claim 1 wherein the SiO2 layer covers the interior area of the substrate and a saw street area surrounding the second termination ring, but does not cover a frame area of the substrate underlying the termination rings and the berm.

7. A printhead die as in claim 1 , wherein the dielectric layer comprises a thin-film layer of TEOS deposited on the surface and BPSG deposited on the TEOS.

8. A printhead die as in claim 1 , further comprising kerf chip barriers at borders between the berm and the termination rings.

9. A printhead die as in claim 8 , wherein a kerf chip barrier comprises an intersection between a presence of the dielectric layer and an absence of the dielectric layer.

10. A printhead die as in claim 1 , further comprising:
a portion of a saw street bordering the second termination ring; and
a kerf chip barrier at the border between the second termination ring and the saw street.

11. A printhead die as in claim 1 , further comprising:
a fluid slot formed in the substrate; and
a drop generator formed on the substrate to eject fluid drops.

12. A printhead die as in claim 11 , wherein the drop generator comprises:
a thermal resistor formed in a resistive layer;
a fluidic chamber defined by a chamber layer; and
a nozzle defined by a nozzle layer.

13. A printhead die comprising:
a SiO2 layer grown into a surface of a silicon substrate;
a dielectric layer deposited onto an interior surface area of the substrate;
multiple termination rings formed concentrically around the interior surface area, each ring defined by an absence of the dielectric layer; and
a berm in between each termination ring, each berm defined by the presence of the dielectric layer.

14. A printhead die as in claim 13 , wherein the multiple termination rings are each further defined by the SiO2 layer.

15. A printhead die as in claim 13 , wherein each berm is further defined by the SiO2 layer underlying the dielectric layer.

16. A printhead die as in claim 13 , wherein the SiO2 layer covers the interior surface area and a saw street area, but does not cover a frame area in which the multiple termination rings and berms are formed, the frame area being in between the interior surface area and the saw street area.

17. A printhead die as in claim 13 , further comprising kerf chip barriers defined by each border between the multiple termination rings and the berms.

18. A printhead die as in claim 13 , further comprising:
a resistive layer deposited on the dielectric layer;
a thermal resistor formed within the resistive layer;
a chamber layer forming a fluidic chamber over the thermal resistor; and
a tophat layer forming a nozzle over the fluidic chamber.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Fuller Anthony M
• Rivas Rio
• Jensen Kellie Susanne

Classifications

• C23C28/32

  including at least one pure metallic layer · CPC title

• B41J2/14129 Primary

  Layer structure · CPC title

• B41J2/1433 Primary

  Structure of nozzle plates · CPC title

• C23C28/321

  with at least one metal alloy layer · CPC title

• C23C28/345

  with at least one oxide layer · CPC title