Hall sensor mounting in an implantable blood pump

US9492599B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9492599-B2
Application numberUS-201314015542-A
CountryUS
Kind codeB2
Filing dateAug 30, 2013
Priority dateAug 31, 2012
Publication dateNov 15, 2016
Grant dateNov 15, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

First claim

Opening claim text (preview).

What is claimed is: 1. A device for transducing a position of a rotor of an implantable blood pump, the device comprising: a molded interconnect device comprising one or more integrated electronic circuit traces, wherein the molded interconnect device is to be mounted to a printed circuit board; and a Hall sensor coupled to the molded interconnect device for transducing the position of the rotor, wherein the one or more integrated electronic circuit traces are configured to electrically connect the Hall sensor with the printed circuit board of the implantable blood pump. 2. The device of claim 1 , wherein the molded interconnect device further comprises: at least one recess on a surface of the molded interconnect device, the surface being oriented towards the printed circuit board or facing the printed circuit board. 3. The device of claim 2 , wherein the recess is configured to be at least partially filled with an adhesive. 4. The device of claim 3 , wherein the adhesive is configured to secure the molded interconnect device to the printed circuit board during the operation of the pump. 5. The device of claim 2 , wherein the recess is adapted to be form-fit with a soldered joint that electrically connects the printed circuit board with the one or more integrated electronic circuit traces of the molded interconnect device. 6. The device of claim 4 , wherein the adhesive is applied between the Hall sensor and the printed circuit board and/or between a surface of the device and the printed circuit board. 7. The device of claim 1 , wherein the molded interconnect device is configured to be attached on the printed circuit board between pole pieces of a stator of the pump. 8. The device of claim 7 , wherein the Hall sensor is configured to output a voltage that is directly proportional to a strength of a magnetic field that is located in a proximity of the pole pieces and the rotor of the pump. 9. An implantable blood pump comprising: a housing defining an inlet opening and an outlet opening; a dividing wall within the housing defining a blood flow conduit, the blood flow conduit extending between the inlet opening and the outlet opening of the housing; a rotary motor including a stator and a rotor, the stator being disposed within the housing circumferentially about the dividing wall such that the blood flow conduit extends through the stator, the stator being disposed circumferentially about at least a part of the rotor and being positioned relative to the rotor such that in use blood flows within the blood flow conduit through the stator before reaching the rotor, and the rotor having permanent magnetic poles for magnetic levitation of the rotor; and a molded interconnect device carrying a Hall sensor, the Hall sensor being configured to transduce a position of the rotor, wherein the molded interconnect device comprises one or more integrated electronic circuit traces that are configured to electrically connect the Hall sensor with a printed circuit board of the rotary motor, and wherein the molded interconnect device is mounted to the printed circuit board. 10. The implantable blood pump of claim 9 , wherein the molded interconnect device is mounted to the printed circuit board between pole pieces of the stator. 11. The implantable blood pump of claim 10 , wherein the stator includes a first coil for driving the rotor and a second coil for adjusting a radial position of the rotor, the first coil and the second coil being wound around one or more of the pole pieces of the stator. 12. The implantable blood pump of claim 9 , further comprising: at least one recess on a surface of the molded interconnect device, the surface being oriented towards the printed circuit board or facing the printed circuit board. 13. The implantable blood pump of claim 12 , wherein the recess is configured to be at least partially filled with an adhesive, and wherein the adhesive is adapted to mount the molded interconnect device to the printed circuit board during operation of the pump after being applied between the Hall sensor and the printed circuit board and/or after being applied between the surface of the molded interconnect device and the printed circuit board. 14. The implantable blood pump of claim 12 , wherein the recess is adapted to be form-fit with a soldered joint that electrically connects the printed circuit board with the one or more integrated electronic circuit traces of the molded interconnect device. 15. The implantable blood pump of claim 10 , wherein the Hall sensor is configured to output a voltage that is directly proportional to a strength of a magnetic field that is located in a proximity of the pole pieces and the rotor of the pump. 16. The implantable blood pump of claim 9 , further comprising: an active electromagnetic control system configured to radially center the rotor within the blood flow conduit if the position transduced by the Hall sensor is outside a predefined volume within the blood flow conduit. 17. A method of assembling a blood pump, the method comprising: assembling a motor stator and control electronics in a housing circumferentially about an internal dividing wall, the internal dividing wall defining the a blood flow conduit that extends from an inlet opening to an outlet opening of the housing, the stator being assembled in the housing such that the blood flow conduit extends through the motor stator; disposing a magnetically-levitated rotor within the blood flow conduit and surrounded by the stator such that impeller blades carried by the rotor are downstream of the rotor from the inlet opening, and such that, in use, the impeller pumps blood from the inlet opening to the outlet opening through the stator; mounting a molded interconnect device between pole pieces of the motor stator onto a printed circuit board of the motor stator, wherein the molded interconnect device carries a Hall sensor that is configured to transduce a position of the rotor, and wherein the molded interconnect device comprises one or more integrated electronic circuit traces; and electrically connecting the Hall sensor with the printed circuit board using the one or more integrated electronic circuit traces and electrically connecting the printed circuit board with the control electronics. 18. The method of claim 17 , wherein the molded interconnect device is being placed on the printed circuit board by an insertion machine.

Assignees

Inventors

Classifications

  • with surface mounted components (H05K3/32 takes precedence) · CPC title

  • Electromagnetic, inductive or dielectric measuring means · CPC title

  • for measuring angles or tapers; for testing the alignment of axes · CPC title

  • using Hall-effect devices (measuring magnetic variables using Hall-effect or other galvanomagnetic devices G01R33/06) · CPC title

  • Branched · CPC title

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What does patent US9492599B2 cover?
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the print…
Who is the assignee on this patent?
Thoratec Corp
What technology area does this patent fall under?
Primary CPC classification H05K1/119. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).