Manufacturing method of light emitting device in a flip-chip configuration with reduced package size

Patent metadata

Field	Value
Publication number	US-9490398-B2
Application number	US-201314650787-A
Country	US
Kind code	B2
Filing date	Nov 25, 2013
Priority date	Dec 10, 2012
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.

First claim

What is claimed is:

1. A method for manufacturing an LED device having a reflective frame formed around an outer periphery thereof, an LED die, and a phosphor member for wavelength-converting of light emitted from said LED die, the method comprising:
a placement step for placing said LED die on a first support sheet in such a manner that an external connecting electrode provided on a lower side of said LED die faces down;
a phosphor member applying step for applying said phosphor member so as to cover upper and side faces of said LED die;
a groove forming step comprising bonding a second support sheet to an upper surface of said phosphor member on an upper side of said LED die and for forming a groove for separating said LED die by applying a V-shaped blade from a bottom side of said phosphor member;
a reflective resin filling step for filling a reflective resin into said groove; and
a dicing step for dicing to separate said LED device by cutting said reflective resin.

2. The LED device manufacturing method according to claim 1 , wherein in said groove forming step, first a groove having a rectangular cross section is formed in said phosphor member, and then said V-shaped blade is applied from the bottom side of said phosphor member to form a sloping face on a portion of said rectangular cross-section groove, thereby forming a groove that has a sloping face on said bottom side.

3. A method for manufacturing an LED device having a reflective frame formed around an outer periphery thereof, an LED die, and a phosphor member for wavelength-converting of light emitted from said LED die, the method comprising:
a placement step for placing said LED die on a large-sized phosphor sheet in such a manner that an external connecting electrode provided on a lower side of said LED die faces down;
an optically transmissive member filling step for filling an optically transmissive member or a phosphor member different from said phosphor sheet into a gap separating said LED die;
a groove forming step for forming a groove for separating said LED die by applying a V-shaped blade so as to cut through said optically transmissive member or said phosphor member different from said phosphor sheet until reaching said phosphor sheet;
a reflective resin filling step for filling a reflective resin into said groove; and
a dicing step for dicing to separate said LED device by cutting said reflective resin.

Assignees

• Citizen Holdings Co Ltd
• Citizen Electronics

Inventors

• Oyamada Nodoka
• Imazu Kenji
• Mochizuki Shusaku

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title

• H10H20/036

  of packages · CPC title