Optoelectronic semiconductor component

Patent metadata

Field	Value
Publication number	US-9490396-B2
Application number	US-201514931246-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Aug 7, 2009
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.

First claim

The invention claimed is:

1. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having side areas,
a surface at a top side of the optoelectronic semiconductor chip, and
a surface at a bottom side of the optoelectronic semiconductor chip;
a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body;
at least one plated-through hole comprising an electrically conductive material; and
an electrically conductive connection electrically conductively connected to the optoelectronic semiconductor chip and the plated-through hole, wherein
an electrically conducting contact location is arranged at the bottom side of the optoelectronic semiconductor chip and covers the bottom side of the optoelectronic semiconductor chip at least in places,
the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and
the surface at the bottom side of the optoelectronic semiconductor chip is completely free of the shaped body.

2. The optoelectronic semiconductor component according to claim 1 , wherein the shaped body is radiation-absorbent.

3. The optoelectronic semiconductor component according to claim 1 , wherein the shaped body is optically reflective and/or radiation-transmissive.

4. The optoelectronic semiconductor component according to claim 1 , wherein the shaped body comprises a matrix material containing an epoxy resin or consists of an epoxy resin.

5. The optoelectronic semiconductor component according to claim 1 , wherein the electrically conductive connection extends at the surface at the top side of the shaped body.

6. The optoelectronic semiconductor component according to claim 1 , comprising a multiplicity of optoelectronic semiconductor chips electrically conductively connected to one another by electrically conductive connections extending at the top side of the shaped body.

7. The optoelectronic semiconductor component according to claim 1 , wherein the shaped body does not project beyond the optoelectronic semiconductor chip in a vertical direction that runs along the side areas of the optoelectronic semiconductor chip.

8. The optoelectronic semiconductor component according to claim 1 , wherein the contact location is freely accessible.

9. The optoelectronic semiconductor component according to claim 1 , which is free of a carrier such that the plated-through hole is connectable at the top side and at the underside of the shaped body.

10. The optoelectronic semiconductor component according to claim 1 , wherein the surface at the top side of the optoelectronic semiconductor chip is completely free of the shaped body.

11. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having side areas,
a surface at a top side of the optoelectronic semiconductor chip, and a surface at a bottom side of the optoelectronic semiconductor chip;
a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body;
at least one plated-through hole comprising an electrically conductive material; and
an electrically conductive connection electrically conductively connected to the optoelectronic semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the shaped body covers the side areas of the optoelectronic semiconductor chip in such a way that the side areas of the optoelectronic semiconductor chip are free of the shaped body in places or the surface at the top side and the surface at the underside of the shaped body terminates flush with the surface at the top side and the surface at the bottom side of the optoelectronic semiconductor chip, respectively.

12. The optoelectronic semiconductor component according to claim 11 , wherein the shaped body does not project beyond the optoelectronic semiconductor chip in a vertical direction that runs along the side areas of the optoelectronic semiconductor chip.

13. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having side areas,
a surface at a top side of the optoelectronic semiconductor chip, and
a surface at a bottom side of the optoelectronic semiconductor chip; and
a shaped body having a surface at a top side of the shaped body and
a surface at an underside of the shaped body, wherein
the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are free of the shaped body, and
the shaped body covers the side areas of the optoelectronic semiconductor chip in such a way that the side areas of the optoelectronic semiconductor chip are free of the shaped body in places or the surface at the top side and the surface at the underside of the shaped body terminates flush with the surface at the top side and the surface at the underside of the optoelectronic semiconductor chip, respectively.

14. The optoelectronic semiconductor component according to claim 13 , wherein the shaped body does not project beyond the optoelectronic semiconductor chip in a vertical direction that runs along the side areas of the optoelectronic semiconductor chip.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Weidner Karl
• Wirth Ralph
• Kaltenbacher Axel
• Wegleiter Walter
• Barchmann Bernd
• Wutz Oliver
• Marfeld Jan

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/141

  the encapsulations being on at least the sidewalls of the semiconductor body · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/856

  Reflecting means · CPC title