Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device

Patent metadata

Field	Value
Publication number	US-9488911-B2
Application number	US-201514831801-A
Country	US
Kind code	B2
Filing date	Aug 20, 2015
Priority date	Feb 21, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein,

and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

First claim

The invention claimed is:

1. A photosensitive composition containing a compound represented by the following Formula (I):

in Formula (I),
Y represents a monovalent organic group that is heterocyclic,
R 1 represents a monovalent organic group,
each of R 2 and R 2′ independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a heteroaryl group, and R 2 and R 2′ may be bound with each other to form a nitrogen-containing heterocyclic group.

2. The photosensitive composition as claimed in claim 1 ,
wherein the compound represented by Formula (I) is a compound represented by the following Formula (II):

in Formula (II),
each of R 3 to R 6 independently represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, provided that, R 3 and R 4 , R 4 and R 5 , or R 5 and R 6 may be bound with each other to form an alicyclic or aromatic ring,
X represents —O— or —S—,
R 1 , R 2 and R 2′ are the same as R 1 , R 2 and R 2′ in Formula (I) above, respectively,
R 2 and R 2′ may be bound to each other to form a nitrogen-containing heterocyclic group.

3. A photocurable composition containing the photosensitive composition claimed in claim 1 ,
wherein the photosensitive composition further contains a base-reactive compound.

4. The photocurable composition as claimed in claim 3 ,
wherein the base-reactive compound is an epoxy resin.

5. The photocurable composition as claimed in claim 3 ,
wherein the base-reactive compound is a polyamic acid.

6. A chemical amplification resist composition containing the photosensitive composition claimed in claim 1 ,
wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

7. The chemical amplification resist composition as claimed in claim 6 , containing a resin (E) having a repeating unit represented by the Formula (1):

in Formula (1),
R 11 represents a hydrogen atom, a methyl group which may have a substituent, or a halogen atom,
B 1 represents a single bond or a divalent organic group,
Ar represents an aromatic ring group, and
m1 represents an integer of 1 or more.

8. The chemical amplification resist composition as claimed in claim 6 , which is used for exposure of electron beam or extreme-ultraviolet rays.

9. A resist film formed using the chemical amplification resist composition claimed in claim 6 .

10. A pattern forming method comprising:
exposing the resist film claimed in claim 9 ; and
developing the exposed resist film.

11. A method of manufacturing an electronic device, comprising the pattern forming method claimed in claim 10 .

12. A photosensitive composition containing a compound represented by the following Formula (I):

in Formula (I),
Y represents a monovalent organic group,
R 1 represents a monovalent organic group,
each of R 2 and R 2′ independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a heteroaryl group, and R 2 and R 2′ may be bound with each other to form a nitrogen-containing heterocyclic group,
wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and
wherein the photosensitive composition further contains a resin (C) having a repeating unit having a group capable of decomposing by the action of an acid to generate a polar group.

13. The photosensitive composition according to claim 12 , wherein the repeating unit in the resin (C) having a group capable of decomposing by the action of an acid to generate a polar group is represented by Formula (A):

in Formula (A), each of R 01 , R 02 and R 03 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group,
Ar 1 represents an alkylene group or an aromatic ring group,
R 03 may be an alkylene group, and may be bound to Ar 1 as an aromatic ring group to form a ring together with a —C—C— chain,
n represents an integer of 1 to 4,
each of n F's independently represents a hydrogen atom or a group capable of leaving by the action of an acid, and at least one F represents a group capable of leaving by the action of an acid, wherein the group capable of leaving by the action of an acid is represented by Formula (B):

in Formula (B),
each of L 1 and L 2 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group,
M represents a single bond or a divalent linking group,
Q represents an alkyl group, a cycloalkyl group, a cyclic aliphatic group, aromatic ring group, an amino group, an ammonium group, a mercapto group, a cyano group, or an aldehyde group, and the cyclic aliphatic groups and aromatic ring groups may contain a hetero atom.

14. The photosensitive composition according to claim 12 , wherein the repeating unit in the resin (C) having a group capable of decomposing by the action of an acid to generate a polar group is represented by Formula (X):

in Formula (X),
Xa 1 represents a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxyrnethyl group,
T represents a single bond or a divalent linking group, and
each of Rx, to Rx 3 independently may be a linear or branched alkyl group or a monocyclic or polycyclic cycloalkyl group, and at least two of Rx 1 to Rx 3 may be bound to each other to form a monocyclic or polycyclic cycloalkyl group.

15. A photosensitive composition containing a compound represented by the following Formula (I):

in Formula (I),
Y represents a monovalent organic group,
R 1 represents a monovalent organic group,
each of R 2 and R 2′ independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a heteroaryl group, and R 2 and R 2′ may be bound with each other to form a nitrogen-containing heterocyclic group,
wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and
wherein the photosensitive composition further contains a crosslinking agent (D).

16. The photosensitive composition according to claim 15 , wherein the crosslinking agent (D) contains a compound having two or more hydroxyl methyl groups or alkoxy methyl groups.

17. The photosensitive composition according to claim 15 , wherein the photosensitive composition fu

Assignees

• Fujifilm Corp

Inventors

• Tsuchimura Tomotaka
• Sakita Kyouhei

Classifications

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/32

  Liquid compositions therefor, e.g. developers · CPC title

• G03F7/0382

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• G03F7/0045 Primary

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title