Bonding material and bonding body, and bonding method

Patent metadata

Field	Value
Publication number	US-9486879-B2
Application number	US-201113988387-A
Country	US
Kind code	B2
Filing date	May 13, 2011
Priority date	Nov 22, 2010
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 μm or more and 10 μm or less, and an organic material having two or more carboxyl groups.

First claim

The invention claimed is:

1. A bonding method of bonding a plurality of members, comprising:
coating a bonding surface of a first member with a bonding material;
applying auxiliary calcination to the first member coated with the bonding material, by heating the first member coated with the bonding material to 50° C. or more and 150° C. or less for 30 seconds or more and 10 minutes or less;
cooling the first member coated with the bonding material after the auxiliary calcination;
setting a second member on a layer of the bonding material with which the cooled first member is coated; and
applying full calcination to the first member on which the second member is set, by applying heat treatment thereto to a higher temperature than the temperature of the auxiliary calcination with pressurization of 20 MPa or less added onto bonding surfaces of the first member and the second member, to thereby form a bonding layer between the first member and the second member,
wherein the bonding material comprises silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, silver particles having an average particle size of 0.5 um or more and 10 um or less, an organic material having two or more carboxyl groups, and a dispersion medium.

2. The bonding method according to claim 1 , wherein the organic material having two or more carboxyl groups has an ether bond.

3. The bonding method according to claim 1 , wherein the organic material having two or more carboxyl groups is an oxydiacetic acid.

4. The bonding method according to claim 1 , wherein the silver nanoparticles are coated with a fatty acid having a carbon number of 3 or more and 6 or less.

5. The bonding method according to claim 1 , wherein the full calcination is performed in an inert gas atmosphere.

6. The bonding method according to claim 1 , wherein the full calcination is performed at a temperature of 150° C. or more and 500° C. or less.

7. The bonding method according to claim 1 , wherein a rate of heating temperature rise is set to 0.1° C./second or more and 2.0° C./second or less in the full calcination.

8. The bonding method according to claim 1 , wherein the bonding material is a paste comprising the silver nanoparticles.

Assignees

• Kurita Satoru
• Endoh Keiichi
• Saito Yu
• Hisaeda Yutaka
• Ueyama Toshihiko
• Dowa Electronics Materials Co Ltd

Inventors

• Kurita Satoru
• Endoh Keiichi
• Saito Yu
• Hisaeda Yutaka
• Ueyama Toshihiko

Classifications

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title