Imaging element and method of manufacturing imaging element
US-2024243155-A1 · Jul 18, 2024 · US
Method for fabricating an image sensor package
US9484385B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9484385-B2 |
| Application number | US-201514948871-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 23, 2015 |
| Priority date | Aug 1, 2007 |
| Publication date | Nov 1, 2016 |
| Grant date | Nov 1, 2016 |
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Abstract
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An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for fabricating an image sensor package, comprising: providing a first substrate comprising a via therein, wherein the first substrate comprises an upper surface and a lower surface opposite the upper surface; forming a driving circuit on the upper surface of the first substrate and electrically connected to the via; bonding a second substrate to the first substrate, wherein the second substrate comprises a first surface and a second surface opp…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9484385B2 cover?
- An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can…
- Who is the assignee on this patent?
- Visera Technologies Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01L27/14683. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).