Processing chamber with features from side wall

Patent metadata

Field	Value
Publication number	US-9484243-B2
Application number	US-201414255730-A
Country	US
Kind code	B2
Filing date	Apr 17, 2014
Priority date	Apr 17, 2014
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A processing chamber having a chamber housing with a top and sidewalls is provided. The processing chamber has a seal for connecting the sidewalls of the chamber housing to a top of a lower chamber below the processing chamber. A substrate holder is attached to the sidewalls of the chamber housing. Further, a wafer lift ring supported by a side arm extending through the sidewalls has at least three posts each having at least one finger, the top of the fingers defining a first wafer handoff plane. The lower chamber has at least one lowest wafer support that defines a second wafer handoff plane where the height between the first wafer handoff plane and the second wafer handoff plane is not greater than a maximum vertical stroke of a transfer arm that is configured to transfer a wafer from the first wafer handoff plane and the second wafer handoff plane.

First claim

What is claimed is:

1. A processing chamber, comprising:
a chamber housing having a top and sidewalls;
a seal for connecting the sidewalls of the chamber housing to a top of a lower chamber positioned below the processing chamber;
a substrate holder that is attached to the sidewalls of the chamber housing;
a wafer lift ring supported by a side arm extending through the sidewalls of the chamber housing, wherein the wafer lift ring has at least three posts that stand verticall…

Assignees

• Lam Res Corp

Inventors

• Larson Dean J
• Augustino Jason
• Fischer Andreas
• Desepte Andre W
• Singh Harmeet

Classifications

• H10P72/0462

  Electricity · mapped topic

• H10P72/7624 Primary

  Electricity · mapped topic

• H10P72/3202

  Electricity · mapped topic

• H10P72/0451 Primary

  Electricity · mapped topic

• H01L21/68785 Primary

  Electricity · mapped topic