Repeatable heat-treating methods and apparatus

Patent metadata

Field	Value
Publication number	US-9482468-B2
Application number	US-52107406-A
Country	US
Kind code	B2
Filing date	Sep 14, 2006
Priority date	Sep 14, 2005
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.

First claim

What is claimed is:

1. A method comprising:
a. monitoring at least one thermal efficiency parameter of an irradiance system configured to produce an irradiance flash incident on a surface of a semiconductor workpiece, wherein monitoring comprises calculating the at least one thermal efficiency parameter of the irradiance system; and
b. automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter;
wherein calculating the at least one thermal efficiency parameter of the irradiance system comprises calculating a combined efficiency parameter representing an electrical-to-optical conversion efficiency and an optical delivery efficiency of the irradiance system.

2. The method of claim 1 wherein calculating comprises calculating the at least one thermal efficiency parameter of the irradiance system in response to a measurement of an actual temperature increase of the surface of the workpiece caused by the irradiance flash.

3. The method of claim 1 wherein monitoring comprises monitoring energy density of radiant energy of the flash arriving at the surface.

4. The method of claim 1 wherein automatically updating comprises automatically updating at least one stored efficiency parameter.

5. The method of claim 1 wherein automatically updating comprises automatically varying an output energy of the irradiance flash.

6. The method of claim 5 wherein automatically varying comprises automatically varying an amount of stored electrical charge used to produce the irradiance flash.

7. The method of claim 1 further comprising:
a) predicting a heating effect of the irradiance flash upon the surface of the workpiece, in response to a measurement of a heating parameter of the surface; and
b) pre-adjusting the irradiance flash, in response to the predicted heating effect.

8. The method of claim 7 wherein predicting comprises predicting respective heating effects of a similar irradiance flash to be incident upon respective surfaces of a plurality of similar workpieces, in response to respective measurements of respective heating parameters of the respective surfaces.

9. The method of claim 8 wherein the workpieces are ostensibly identical.

10. The method of claim 7 wherein predicting the heating effect of the irradiance flash comprises predicting a peak temperature of the surface.

11. The method of claim 7 wherein predicting the heating effect of the irradiance flash comprises predicting an amount of energy of the irradiance flash to be absorbed by the surface.

12. The method of claim 7 further comprising measuring the heating parameter of the surface.

13. The method of claim 12 wherein measuring the heating parameter comprises measuring a reflectivity of the surface.

14. The method of claim 12 wherein measuring the heating parameter comprises measuring an emissivity of the surface.

15. The method of claim 12 wherein measuring comprises measuring the heating parameter in a wavelength spectrum corresponding to the irradiance flash.

16. The method of claim 15 wherein measuring comprises measuring a plurality of values of the heating parameter at a plurality of respective wavelengths of the spectrum.

17. The method of claim 12 wherein measuring the heating parameter comprises compensating for small-scale angular variations in the heating parameter.

18. The method of claim 17 wherein compensating comprises measuring the heating parameter over a sufficiently large area of the surface to effectively average out the small-scale angular variations.

19. The method of claim 18 wherein the surface comprises a device side of a semiconductor wafer, and wherein measuring the heating parameter over a sufficiently large area comprises measuring the heating parameter over an area at least about 1 cm wide.

20. The method of claim 19 wherein measuring comprises measuring the heating parameter over an area at least about 2 cm wide.

21. The method of claim 17 wherein measuring comprises measuring the heating parameter with a fiber optic probe.

22. The method of claim 14 wherein measuring the emissivity comprises illuminating the surface with an irradiance spectrum comprising wavelengths of the irradiance flash.

23. The method of claim 22 wherein illuminating comprises illuminating the surface with an irradiance spectrum produced by an illumination source other than a source of the irradiance flash.

24. The method of claim 23 wherein the illumination source further comprises a filter configured to simulate an irradiance spectrum of the source of the irradiance flash.

25. The method of claim 22 wherein pre-adjusting comprises pre-adjusting a future irradiance flash to be incident upon a first surface of a first workpiece, contemporaneously with an incidence of a present irradiance flash upon a similar surface of a second workpiece.

26. The method of claim 7 wherein predicting the heating effect comprises predicting the heating effect in response to a measurement of an emissivity of the surface and an amount of energy to be delivered to the surface by the irradiance flash.

27. The method of claim 16 wherein predicting the heating effect comprises convolving the plurality of values of the heating parameter at the plurality of respective wavelengths of the spectrum with a plurality of irradiance values indicative of respective amounts of irradiance at the respective wavelengths to be delivered to the surface by the flash.

28. The method of claim 27 wherein convolving comprises convolving a plurality of absorptivity values of the surface at the plurality of respective wavelengths with a plurality of irradiance energy values indicative of respective amounts of radiant energy at the respective wavelengths to be delivered to the surface by the flash.

29. The method of claim 28 wherein predicting the heating effect further comprises summing a plurality of absorbed energy values resulting from the convolving.

30. The method of claim 7 wherein pre-adjusting comprises pre-adjusting an amount of stored electrical energy to be used to generate the irradiance flash.

31. The method of claim 30 wherein the stored electrical energy comprises electrical charge stored in a capacitor bank.

32. The method of claim 1 , further comprising supplying an electrical pulse to an irradiance device configured to produce the irradiance flash incident on the workpiece, wherein a fall time of the pulse is less than a rise time of the pulse.

33. The method of claim 32 wherein the pulse comprises a sawtooth-shaped pulse.

34. The method of claim 32 wherein supplying comprises causing the pulse to abruptly transition from the rise time to the fall time.

35. The method of claim 34 wherein causing comprises firing a crowbar circuit to cause the pulse to transition from the rise time to the fall time.

36. The method of claim 34 wherein causing comprises shorting across the irradiance device to cause the pulse to transition from the rise time to the fall time.

37. The method of claim 1 , wherein calculating the combined efficiency parameter comprises calculating a slope value and an offset value of a linear model of the com

Assignees

• Camm David Malcolm
• Dets Sergiy
• Mcdonnell Kevin
• Stuart Greg
• Thrum Tilman
• Rudic Igor
• Kaludjercic Ljubomir
• Mattson Tech Inc

Inventors

• Camm David Malcolm
• Dets Sergiy
• Mcdonnell Kevin
• Stuart Greg
• Thrum Tilman
• Rudic Igor
• Kaludjercic Ljubomir

Classifications

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• F27B17/0025 Primary

  specially adapted for treating semiconductor wafers · CPC title

• H01L22/20

  Electricity · mapped topic