Thermoelectric module

Patent metadata

Field	Value
Publication number	US-9482452-B2
Application number	US-201314028924-A
Country	US
Kind code	B2
Filing date	Sep 17, 2013
Priority date	Sep 19, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A thermoelectric module includes an insulating substrate, plural electrodes formed on a component side of the insulating substrate, plural peltier elements each mounted on and electrically connected to the electrodes, and a mark for image recognition formed at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image. An entire of the electrode is usable as an electrical conduction path.

First claim

The invention claimed is:

1. A thermoelectric module, comprising:
an insulating substrate;
a plurality of electrodes formed on a component side of the insulating substrate;
a plurality of peltier elements each mounted on and electrically connected to the electrodes; and
a mark for image recognition formed on at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image; wherein
an entire of the electrode is usable as an electrical conduction path,
the mark for image recognition is a plating layer of the at least one of the electrodes,
the plating layer is an electroless plating film or an electroplating film,
the electrode includes a fixture side facing the insulating substrate and a component side provided at a reverse side of the fixture side,
the component side of the electrode includes a mounting region on which the peltier elements are mounted and a general region which is a region other than the mounting region of the electrode,
the mark for image recognition is formed on the general region of the electrode,
the mark for image recognition includes a protruding configuration that is formed on at least a portion of the general region of the electrodes, and
a length of the mark for image recognition from the component side in a thickness direction of the electrode is shorter than a length of the peltier elements from the component side in the thickness direction.

2. The thermoelectric module according to claim 1 , wherein
the mark for image recognition includes a plurality of marks for image recognition and each of the marks for image recognition is formed on the separate electrode.

3. The thermoelectric module according to claim 1 , wherein the mark for image recognition is a black nickel plating.

4. The thermoelectric module according to claim 1 , wherein an entirety of the mark for image recognition is between the peltier elements.

5. The thermoelectric module according to claim 1 , wherein the mark for image recognition is between the peltier elements and extends an entire width of the electrode.

Assignees

• Aisin Seiki

Inventors

• Morimoto Akihiro

Classifications

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title

• H10W40/28

  comprising Peltier coolers · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title