Method of manufacturing non-firing type electrode

Patent metadata

Field	Value
Publication number	US-9480166-B2
Application number	US-201414217631-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Apr 16, 2013
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A method of manufacturing a non-fired type electrode comprising the steps of: (a) applying a conductive paste on a substrate, the conductive paste comprising; (i) 100 parts by weight of a conductive powder; (ii) an organic boron compound comprising an amine borate, a boronic acid, a boronic acid ester, a trimer of the boronic acid or a mixture thereof, wherein the boron element of the organic boron compound is 0.03 to 1.4 parts by weight; and (iii) 20 to 150 parts by weight of an organic vehicle; and (b) heating the applied conductive paste at 100 to 300° C.

First claim

What is claimed is:

1. A method of manufacturing a non-fired type electrode comprising the steps of:
(a) applying a conductive paste on a substrate, wherein the substrate is selected from the group consisting of a polymer film, a glass substrate and a ceramic substrate, the conductive paste comprising;
(i) 100 parts by weight of a conductive powder;
(ii) an organic boron compound selected from the group consisting of an amine borate, a boronic acid, a boronic acid ester, a trimer of a boronic acid and a mixture thereof, wherein the boron (B) element of the organic boron compound is 0.03 to 1.4 parts by weight; and
(iii) 20 to 150 parts by weight of an organic vehicle, wherein viscosity of the conductive paste is between 30 to 500 Pa·s at 10 rpm;

(b) heating the applied conductive paste at 100 to 300° C.

2. The method of claim 1 , wherein the organic boron compound is 0.5 to 20 parts by weight.

3. The method of claim 1 , wherein the organic boron compound comprises a trimer of the boronic acid.

4. The method of claim 1 , wherein the melting point of the organic boron compound is 50° C. or higher.

5. The method of claim 1 , wherein the average particle size of the conductive powder is 0.5 to 10 μm.

6. The method of claim 1 , wherein the conductive powder comprises a metal selected from the group consisting of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), molybdenum (Mo), tungsten (W), zinc (Zn), alloy thereof and a mixture thereof.

7. A device having the non-fired type electrode manufactured by the method of claim 1 .

8. The method of claim 1 , wherein the organic boron compound comprises a boronic acid expressed with formula (I) or (II):

where R and R′ is independently alkyl group, substituted alkyl group, alkenyl group, substituted alkenyl group, aryl group or substituted aryl group.

9. The method of claim 1 , wherein the organic boron compound comprises a boronic acid ester expressed with formula (III) or (IV):

where R, R′ and R″ is independently alkyl group, substituted alkyl group, alkenyl group, substituted alkenyl group, aryl group or substituted aryl group.

Assignees

• Du Pont

Inventors

• Inaba Akira
• Yamashita Satomi

Classifications

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• C08L71/00

  Compositions of polyethers obtained by reactions forming an ether link in the main chain (of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06); Compositions of derivatives of such polymers · CPC title

• H05K3/102

  by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence) · CPC title

• C08G2650/56

  Polyhydroxyethers, e.g. phenoxy resins · CPC title