Thermal management system and method

US9478479B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9478479-B2
Application numberUS-91199510-A
CountryUS
Kind codeB2
Filing dateOct 26, 2010
Priority dateOct 26, 2010
Publication dateOct 25, 2016
Grant dateOct 25, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.

First claim

Opening claim text (preview).

What is claimed as new and desired to be protected by Letters Patent of the United States is: 1. A thermal management system comprising: at least one heat sink comprising one or more respective fins, at least one of the one or more fins comprising one or more respective cavities; and a synthetic jet stack comprising at least one synthetic jet inserted within each of the respective cavities of the fins employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet comprises at least one orifice through which a fluid is ejected, wherein the at least one engaging structure comprises a plurality of locater pins disposed on an outer surface of the synthetic jet, the locater pins fitted into a plurality of respective holes drilled into the heat sink forming a tight mechanical coupling between the synthetic jet and the fin. 2. The thermal management system of claim 1 , wherein the at least one engaging structure comprises an array of wires attaching each of the at least one synthetic jets to the respective one or more fins. 3. The thermal management system of claim 1 , wherein the at least one engaging structure comprises a gasket adhesively coupled to an outer surface of the at least one synthetic jet and an inner surface of the fins. 4. The thermal management system of claim 1 , wherein the at least one engaging structure comprises a plurality of bumps formed on an outer surface of the synthetic jet, the plurality of bumps disposed upon a plurality of respective dimples embedded on the surface of the fins. 5. The thermal management system of claim 1 , wherein the at least one engaging structure comprises: a sheet of non-conductive tape adhered to each outer surface of the synthetic jets; and a layer of silicone applied at a top opening side of the fins to enclose the synthetic jets into the cavities. 6. The thermal management system of claim 1 , wherein the at least one engaging structure comprises: extrusions in the synthetic jets that fit into external support slots on at least one of a top and a bottom surface of the fins; and a silicone adhesive applied to the slots to ensure a rigid attachment. 7. The thermal management system of claim 1 , wherein the at least one engaging structure comprises a fin cap disposed on a top opening of each of the respective fins such that the synthetic jets are rigidly disposed within the fins, the fin cap comprising one or more holes to facilitate electrical connection to the synthetic jets. 8. The thermal management system of claim 1 , wherein the at least one engaging structure comprises a top plate comprising a plurality of fin caps configured to cover each of the fins, such that the synthetic jets are rigidly disposed within the fins, the fin cap comprising one or more holes to facilitate electrical connection to the synthetic jets. 9. A method for manufacturing a thermal management system, the method comprising: disposing at least one heat sink comprising one or more respective fins, each of the fins comprising one or more respective cavities; and inserting a synthetic jet stack comprising at least one synthetic jet within each of the respective cavities of the fins, employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet comprises at least one orifice through which a fluid is ejected, wherein employing the at least one engaging structure comprises: disposing a plurality of locater pins on an outer surface of the synthetic jet; and fitting the locator pins into a plurality of respective holes drilled into the heat sink forming a tight mechanical coupling between the synthetic jet and the fin. 10. The method of claim 9 , wherein said employing the at least one engaging structure comprises attaching an array of wires into each of the at least one synthetic jets to the respective one or more fins. 11. The method of claim 9 , wherein said employing the at least one engaging structure comprises adhesively coupling a gasket to an outer surface of the at least one synthetic jet and an inner surface of the fins. 12. The method of claim 9 , wherein said employing the at least one engaging structure comprises: forming a plurality of bumps on an outer surface of the synthetic jet; and disposing the plurality of bumps upon a plurality of respective dimples embedded on the surface of the fins. 13. The method of claim 9 , wherein employing at least one engaging structure comprises: adhering a sheet of non-conductive tape to each outer surface of the synthetic jets; and applying a layer of silicone at a top opening side of the fins to enclose the synthetic jets into the cavities. 14. The method of claim 9 , wherein employing the at least one engaging structure comprises: forming extrusions in the synthetic jets; fitting said extrusions into a plurality of external support slots on at least one of a top and a bottom surface of the fins; and a silicone adhesive applied to the slots to ensure a rigid attachment. 15. The method of claim 9 , wherein employing the at least one engaging structure comprises disposing a fin cap on a top opening of each of the respective fins such that the synthetic jets are rigidly disposed within the fins, the fin cap comprising one or more holes to facilitate electrical connection to the synthetic jets. 16. The method of claim 9 , wherein employing the at least one engaging structure comprises disposing a top plate comprising a plurality of fin caps configured to cover each of the fins, such that the synthetic jets are rigidly disposed within the fins, the fin cap comprising one or more holes to facilitate electrical connection to the synthetic jets.

Assignees

Inventors

Classifications

  • using jet impingement (H10W40/776 takes precedence) · CPC title

  • Assembling together parts thereof · CPC title

  • H10W40/43Primary

    by flowing gases, e.g. forced air cooling · CPC title

  • Heat sinks · CPC title

  • heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

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Frequently asked questions

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What does patent US9478479B2 cover?
A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging str…
Who is the assignee on this patent?
Arik Mehmet, Gerstler William Dwight, Li Ri, and 3 more
What technology area does this patent fall under?
Primary CPC classification H10W40/43. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).