Polymer, method for preparing the same, and a photosensitive resin composition thereof

Patent metadata

Field	Value
Publication number	US-9477148-B1
Application number	US-201514721487-A
Country	US
Kind code	B1
Filing date	May 26, 2015
Priority date	May 26, 2015
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A polymer, a method for preparing the same, and a photosensitive resin composition thereof are provided. The polymer has a structure represented by Formula (I):

wherein R 1 is —OH, or —COOH; A 1 is

each A 2 is independently

each A 3 is independently

Z is —O—, —S—, —C(CH3)2-, —C(CF3)2-,

m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and, the repeat units

are arranged in a random fashion.

First claim

What is claimed is:

1. A polymer, having a structure represented by Formula (I):

wherein, R 1 is —OH, or —COOH; A 1 is

each A 2 is independently

each A 3 is independently

A 4 is

Z is —O—, —SO 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —,

m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and the repeat units represented by

and the repeat units represented by

are arranged in a random fashion.

2. The polymer as claimed in claim 1 , wherein m/(m+n) is between 0.05 and 0.9.

3. The polymer as claimed in claim 1 , wherein m/(m+n) is between 0.1 and 0.4.

4. A method for preparing the polymer as claimed in claim 1 , comprising:
subjecting a composition to a polymerization, obtaining the polymer as claimed in claim 1 , wherein the composition comprises an anhydride having a structure represented by Formula (II), a diamine having a structure represented by Formula (III), a diamine having a structure represented by Formula (IV), and a compound having a structure represented by Formula (V)
H 2 N-A 2 -NH 2   Formula(IV)

H 2 N-A 3 -R 1   Formula (V)

wherein, R 1 is —OH, or —COOH;
A 1 is

A 2 is

A 3 is

A 4 is

Z is —O—, —SO 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —,

i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20.

5. The method as claimed in claim 4 , wherein the composition comprises 1 part by mole of the anhydride having a structure represented by Formula (II), 0.2-0.5 parts by mole of the diamine having a structure represented by Formula (III), 0.4-0.9 parts by mole of the diamine having a structure represented by Formula (IV), and 0.1-0.4 parts by mole of the compound having a structure represented by Formula (V).

6. The method as claimed in claim 4 , wherein the ratio between the sum of the moles of the diamines having structures represented by Formula (III) and Formula (IV) and one-half of the moles of the compound having a structure represented by Formula (V) to the moles of the anhydride having a structure represented by Formula (II) is from 0.7 to 1.6.

7. The method as claimed in claim 4 , wherein the ratio between the sum of the moles of the diamines having structures represented by Formula (III) and Formula (IV) and one-half of the moles of the compound having a structure represented by Formula (V) to the moles of the anhydride having a structure represented by Formula (II) is from 0.8 to 1.2.

8. The method as claimed in claim 4 , wherein the ratio between the moles of the diamine having a structure represented by Formula (III) to the sum of the moles of the diamines having structures represented by Formula (III) and Formula (IV) is from 0.05 to 0.9.

9. The method as claimed in claim 4 , wherein the ratio between the moles of the diamine having a structure represented by Formula (III) to the sum of the moles of the diamines having structures represented by Formula (III) and Formula (IV) is from 0.1 to 0.4.

10. The method as claimed in claim 4 , wherein the mole ratio between the compound having a structure represented by Formula (V) to the anhydride having a structure represented by Formula (II) is from 0.1 to 0.3.

11. A photosensitive resin composition, comprising components (A)-(C) uniformly distributed in a solvent:
(A) the polymer as claimed in claim 1 ;
(B) a compound having a phenyl group; and
(C) a photosensitive agent.

12. The photosensitive resin composition as claimed in claim 11 , wherein the photosensitive resin composition comprises 100 parts by weight of (A) the polymer, 1-50 parts by weight of (B) the compound, and 1-50 parts by weight of (C) the photosensitive agent.

13. The photosensitive resin composition as claimed in claim 11 , wherein (B) the compound is

or a combination thereof.

14. The photosensitive resin composition as claimed in claim 11 , wherein (C) the photosensitive agent comprises quinonediazide sulfonate.

15. The photosensitive resin composition as claimed in claim 11 , wherein (C) the photosensitive agent is

or a combination thereof, wherein D is independently —OH,

and at least one of D is not —OH.

16. The photosensitive resin composition as claimed in claim 11 , wherein the solvent is N-methyl-2-pyrrolidone, γ-butyrolactone, or a combination thereof.

Assignees

• Ind Tech Res Inst

Inventors

• Jeng Jyh-Long
• Tsai Jeng-Yu
• Yang Wei-Ta

Classifications

• C08G73/1042

  Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title

• G03F7/0233 Primary

  characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides · CPC title

• C08G73/106

  containing silicon · CPC title

• C08G73/1007

  from tetracarboxylic acids or derivatives and diamines · CPC title

• C08G73/1039

  comprising halogen-containing substituents · CPC title