Cable termination, joint and repair system

US9475237B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9475237-B2
Application numberUS-201213706326-A
CountryUS
Kind codeB2
Filing dateDec 5, 2012
Priority dateDec 6, 2011
Publication dateOct 25, 2016
Grant dateOct 25, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for encapsulating a cable 12 for the purpose of splice closures, breakout closures, jacket repair closures or end capping, in which a casing is fitted around a part of the cable to be sealed, defining within it a cavity surrounding the cable, and a sealant material in the form of a two part acrylic structural adhesive material is injected to fill the cavity and cured in situ. The two part adhesive has a base resin including a methacrylate monomer and a minor part including an oligomeric synthetic rubber and a curative for the monomer, preferably an organoborane accelerator such as an organoborane amine complex, which may be carried by a polyfunctional aziridine. The two parts are preferably mixed at a volume ratio of 2:1 to 15:1.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of repairing or encapsulating a cable, comprising the steps of forming or positioning an enclosure around a part of a cable to be sealed, the enclosure defining within it a cavity, filling the cavity with a two-part structural adhesive composition and allowing said adhesive composition to cure in situ to bond to a surface of said cable, wherein a base resin of the adhesive composition comprises a methacrylate monomer and a minor part comprises an oligomeric synthetic rubber and cure accelerator for the composition. 2. A method according to claim 1 , wherein the two parts of the composition are mixed at a volume ratio of 2:1 to 15:1. 3. A method according to claim 1 , wherein said methacrylate monomer comprises a methacrylic acid ester of a heterocyclic alcohol. 4. A method according to claim 3 , wherein said methacrylate monomer is tetrahydrofurfuryl methacrylate. 5. A method according to claim 1 , wherein the base resin component of the composition comprises 40 to 70 weight % of said methacrylate monomer. 6. A method according to claim 1 , wherein the base resin component of the composition further comprises a minor amount of an acrylate polymer. 7. A method according to claim 1 , wherein the base resin component of the composition further comprises a minor amount of an styrene-butadiene polymer. 8. A method according to claim 6 , wherein said base resin component comprises 10 to 30 wt % of said acrylate polymer and 10 to 30 wt % of an acrylonitrile-butadiene styrene resin. 9. A method according to claim 1 , wherein the base resin component of the composition has a viscosity of 10 to 25 Pas. 10. A method according to claim 1 , wherein the minor component of the composition comprises an organoborane cure accelerator. 11. A method according to claim 10 , wherein the cure accelerator comprises an organoborane amine complex. 12. A method according to claim 11 , wherein the organoborane-amine complex is carried by one or more polyfunctional aziridines. 13. A method according to claim 1 , wherein the oligomeric rubber is a vinyl aromatic compound. 14. A method according to claim 2 , wherein the oligomeric rubber is an α-methyl styrene polyurea. 15. A method according to claim 1 , wherein the minor part of the composition comprises 40 to 70 wt % of said oligomeric rubber and 10 to 30 wt % of an organoborane curative. 16. A method according to claim 1 , wherein the minor part of the adhesive composition has a viscosity of 20 to 35 Pas. 17. A method according to claim 1 , wherein the enclosure is formed by a heat shrunk tube. 18. A method according to claim 1 , wherein the enclosure defining the cavity for the adhesive is removed after curing of the adhesive. 19. A method according to claim 18 , wherein the enclosure is formed by wrapping around the surface of a damaged cable a tape of a material that does not substantially adhere to said adhesive composition, said cavity being formed by a damaged part of a sheath of said cable, and injecting the adhesive composition under the enclosure into said cavity, whereby the adhesive when cured forms a repair flush with the surface of the cable sheath. 20. A method according to claim 1 , wherein the adhesive composition is cured at ambient temperature. 21. A method according to claim 1 , wherein the oligomeric synthetic rubber is a vinyl aromatic compound. 22. A method of repairing or encapsulating a cable, comprising the steps of forming an enclosure around a part of a cable to be sealed with a heat shrunk tube, the enclosure defining within it a cavity, filling the cavity with a two-part structural adhesive composition and allowing said adhesive composition to cure in situ to bond to a surface of said cable, wherein a base resin of the adhesive composition comprises a methacrylate monomer and a minor part comprises an oligomeric synthetic rubber and cure accelerator for the composition.

Assignees

Inventors

Classifications

  • H02G1/16Primary

    for repairing insulation or armouring of cables · CPC title

  • B29C73/10Primary

    using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title

  • Boxes split longitudinally in main cable direction · CPC title

  • Filling materials, e.g. solid or fluid insulation · CPC title

  • protected by sleeves, e.g. for communication cable (two-part covers H02G15/10 {; preforms having internal stresses B29C61/00}) · CPC title

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Frequently asked questions

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What does patent US9475237B2 cover?
A system for encapsulating a cable 12 for the purpose of splice closures, breakout closures, jacket repair closures or end capping, in which a casing is fitted around a part of the cable to be sealed, defining within it a cavity surrounding the cable, and a sealant material in the form of a two part acrylic structural adhesive material is injected to fill the cavity and cured in situ. The two…
Who is the assignee on this patent?
Tyco Electronics Ltd Uk, Tyco Electronics Ltd Uk
What technology area does this patent fall under?
Primary CPC classification H02G1/16. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).