Bonded compact and method of producing green bonded compact

Patent metadata

Field	Value
Publication number	US-9474193-B2
Application number	US-201314014956-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Sep 4, 2012
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

Provided is a method of producing “a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions,” the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets.

First claim

What is claimed is:

1. A bonded compact which is a fired compact, comprising:
a plate-like substrate having hole portions and being formed of an inorganic material, and
a film, which is bonded on each bonding surface of the substrate, and has a thinner thickness than that of the substrate, the film being formed of an inorganic material having at least one of a different composition and a different microstructure from that of the substrate,
wherein a ratio (T1/L1) of a thickness (T1) of a thinnest portion of the substrate to a maximum length (L1) in a cross-sectional shape of each of the hole portions in the substrate is 0.04 or more and 0.69 or less,
wherein the film is formed of a dense inorganic material having a smaller porosity than that of the substrate, and
wherein the part on which the film is formed in the bonding surface of the substrate has a flatness corresponding to 0.5 times or more and 20 times or less of the average value of the thicknesses of the film.

2. A bonded compact according to claim 1 , wherein:
the bonding surface of the substrate has a part on which the film is formed and a part on which no film is formed; and
a ratio (TB′/TB) of a thickness (TB′) of an edge portion of the film, the edge portion corresponding to a boundary between the part on which the film is formed and the part on which no film is formed, to an average value (TB) of thicknesses of the film is 0.7 or more and 1.3 or less.

3. A bonded compact according to claim 1 , wherein the substrate has a porosity of 0% or more and 45% or less.

4. A bonded compact according to claim 1 , wherein the film has a porosity of 0% or more and 10% or less.

5. A bonded compact according to claim 1 , wherein the substrate has a thickness of 1 mm or more and 8 mm or less, and the film has a thickness of 2 μm or more and 45 μm or less.

6. A bonded compact according to claim 1 , wherein:
the substrate is formed of a ceramic; and
the film is formed of a ceramic having one of a different composition and a different microstructure from that of the substrate.

Assignees

• Ngk Insulators Ltd

Inventors

• Yoshioka Kunihiko
• Ishibashi Satoshi

Classifications

• H01M8/0215

  Glass; Ceramic materials · CPC title

• C04B2237/62

  Forming laminates or joined articles comprising holes, channels or other types of openings · CPC title

• C04B2235/608

  Green bodies or pre-forms with well-defined density · CPC title

• C04B2237/66

  Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage · CPC title

• C04B37/008

  by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch · CPC title